{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T23:26:55Z","timestamp":1730244415893,"version":"3.28.0"},"reference-count":5,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,6]]},"DOI":"10.1109\/icicdt.2016.7542066","type":"proceedings-article","created":{"date-parts":[[2016,8,15]],"date-time":"2016-08-15T18:53:38Z","timestamp":1471287218000},"page":"1-3","source":"Crossref","is-referenced-by-count":0,"title":["Packaging in minimal fab: An integrated semiconductor line from wafer process to packaging process"],"prefix":"10.1109","author":[{"given":"Michihiro","family":"Inoue","sequence":"first","affiliation":[]},{"given":"Fumito","family":"Imura","sequence":"additional","affiliation":[]},{"given":"Arami","family":"Saruwatari","sequence":"additional","affiliation":[]},{"given":"Shiro","family":"Hara","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1541\/ieejjournal.135.538"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1541\/ieejjournal.135.549"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1541\/ieejjournal.135.554"},{"key":"ref2","first-page":"272","volume":"133","author":"khumpung","year":"2013","journal-title":"IEEE Transactions on Sensors and Microelectronics"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1541\/ieejjournal.135.534"}],"event":{"name":"2016 International Conference on IC Design and Technology (ICICDT)","start":{"date-parts":[[2016,6,27]]},"location":"Ho Chi Minh City","end":{"date-parts":[[2016,6,29]]}},"container-title":["2016 International Conference on IC Design and Technology (ICICDT)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7527574\/7542033\/07542066.pdf?arnumber=7542066","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,1,9]],"date-time":"2018-01-09T18:05:32Z","timestamp":1515521132000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7542066\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,6]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/icicdt.2016.7542066","relation":{},"subject":[],"published":{"date-parts":[[2016,6]]}}}