{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,8]],"date-time":"2026-02-08T13:08:44Z","timestamp":1770556124080,"version":"3.49.0"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,6,1]],"date-time":"2019-06-01T00:00:00Z","timestamp":1559347200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,6,1]],"date-time":"2019-06-01T00:00:00Z","timestamp":1559347200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,6,1]],"date-time":"2019-06-01T00:00:00Z","timestamp":1559347200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,6]]},"DOI":"10.1109\/icicdt.2019.8790879","type":"proceedings-article","created":{"date-parts":[[2019,8,8]],"date-time":"2019-08-08T19:25:46Z","timestamp":1565292346000},"page":"1-4","source":"Crossref","is-referenced-by-count":2,"title":["High-Voltage Driver for Fully-Integrated Piezoelectric Inkjet Printhead Module"],"prefix":"10.1109","author":[{"given":"Zhuoqi","family":"Guo","sequence":"first","affiliation":[]},{"given":"Rui","family":"Xu","sequence":"additional","affiliation":[]},{"given":"Li","family":"Geng","sequence":"additional","affiliation":[]},{"given":"Baoxia","family":"Li","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1982.1051851"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2018.2876138"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.900281"},{"key":"ref5","first-page":"533","article-title":"Low-voltage analog circuit techniques using bias-current reutilization, self-biasing and signal superposition","author":"lee","year":"2005","journal-title":"Proc IEEE Int Conf Electron Devices Solid-State Circuits"},{"key":"ref8","doi-asserted-by":"crossref","first-page":"49","DOI":"10.1109\/JPROC.2008.2007463","article-title":"High-Density Through Silicon Vias for 3-D LSIs","volume":"97","author":"koyanagi","year":"2009","journal-title":"Proceedings of the IEEE"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007462"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2015.2441963"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2015.2495723"}],"event":{"name":"2019 International Conference on IC Design and Technology (ICICDT)","location":"SUZHOU, China","start":{"date-parts":[[2019,6,17]]},"end":{"date-parts":[[2019,6,19]]}},"container-title":["2019 International Conference on IC Design and Technology (ICICDT)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8784132\/8790825\/08790879.pdf?arnumber=8790879","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,18]],"date-time":"2022-07-18T11:10:18Z","timestamp":1658142618000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8790879\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,6]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/icicdt.2019.8790879","relation":{},"subject":[],"published":{"date-parts":[[2019,6]]}}}