{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,21]],"date-time":"2026-02-21T20:22:48Z","timestamp":1771705368653,"version":"3.50.1"},"reference-count":26,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,9,21]],"date-time":"2022-09-21T00:00:00Z","timestamp":1663718400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,9,21]],"date-time":"2022-09-21T00:00:00Z","timestamp":1663718400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,9,21]]},"DOI":"10.1109\/icicdt56182.2022.9933131","type":"proceedings-article","created":{"date-parts":[[2022,11,4]],"date-time":"2022-11-04T02:07:33Z","timestamp":1667527653000},"page":"51-54","source":"Crossref","is-referenced-by-count":4,"title":["Innovations in Transistor Architecture and Device Connectivity for Advanced Logic Scaling"],"prefix":"10.1109","author":[{"given":"A.","family":"Veloso","sequence":"first","affiliation":[{"name":"Imec,Leuven,Belgium,3001"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G.","family":"Eneman","sequence":"additional","affiliation":[{"name":"Imec,Leuven,Belgium,3001"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"De Keersgieter","sequence":"additional","affiliation":[{"name":"Imec,Leuven,Belgium,3001"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"P.","family":"Favia","sequence":"additional","affiliation":[{"name":"Imec,Leuven,Belgium,3001"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Hikavyy","sequence":"additional","affiliation":[{"name":"Imec,Leuven,Belgium,3001"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"R.","family":"Chen","sequence":"additional","affiliation":[{"name":"Imec,Leuven,Belgium,3001"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Jourdain","sequence":"additional","affiliation":[{"name":"Imec,Leuven,Belgium,3001"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"N.","family":"Horiguchi","sequence":"additional","affiliation":[{"name":"Imec,Leuven,Belgium,3001"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","first-page":"284","author":"veloso","year":"2022","journal-title":"VLSI Tech Dig"},{"key":"ref11","year":"2021","journal-title":"Synopsys Sentaurus Device & Process Reference Manuals"},{"key":"ref12","first-page":"246","author":"reboh","year":"2019","journal-title":"IEDM Tech Dig"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1149\/09805.0253ecst"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2021.3076754"},{"key":"ref15","first-page":"685","author":"ryckaert","year":"2019","journal-title":"IEDM Tech Dig"},{"key":"ref16","first-page":"697","author":"rachmady","year":"2019","journal-title":"IEDM Tech Dig"},{"key":"ref17","first-page":"th3.1","author":"subramanian","year":"2020","journal-title":"VLSI Tech Dig"},{"key":"ref18","first-page":"425","author":"huang","year":"2020","journal-title":"IEDM Tech Dig"},{"key":"ref19","first-page":"721","author":"radosavljevi?","year":"2021","journal-title":"IEDM Tech Dig"},{"key":"ref4","first-page":"828","author":"mertens","year":"2017","journal-title":"IEDM Tech Dig"},{"key":"ref3","first-page":"677","author":"barraud","year":"2017","journal-title":"IEDM Tech Dig"},{"key":"ref6","first-page":"50","author":"ryckaert","year":"2019","journal-title":"IEEE EDTM Tech Dig"},{"key":"ref5","first-page":"559","author":"veloso","year":"2019","journal-title":"SSDM Tech Dig"},{"key":"ref8","year":"0"},{"key":"ref7","first-page":"tfs2-6","author":"veloso","year":"2021","journal-title":"VLSI Tech Dig"},{"key":"ref2","first-page":"230","author":"loubet","year":"2017","journal-title":"VLSI Tech Dig"},{"key":"ref9","first-page":"498","author":"chen","year":"2021","journal-title":"IEDM Tech Dig"},{"key":"ref1","first-page":"464","author":"barraud","year":"2016","journal-title":"IEDM Tech Dig"},{"key":"ref20","first-page":"230","author":"veloso","year":"2019","journal-title":"IEDM Tech Dig"},{"key":"ref22","first-page":"4","author":"gupta","year":"2018","journal-title":"IITC\/AMC Tech Dig"},{"key":"ref21","first-page":"557","author":"jagannathan","year":"2021","journal-title":"IEDM Tech Dig"},{"key":"ref24","first-page":"51","author":"liebmann","year":"2021","journal-title":"IEDM Tech Dig"},{"key":"ref23","first-page":"494","author":"song","year":"2021","journal-title":"IEDM Tech Dig"},{"key":"ref26","first-page":"s13p1","volume":"267 ty328","author":"huynh-bao","year":"0","journal-title":"DAC 2019"},{"key":"ref25","first-page":"276","author":"mii","year":"2022","journal-title":"VLSI Tech Dig"}],"event":{"name":"2022 International Conference on IC Design and Technology (ICICDT)","location":"Hanoi, Vietnam","start":{"date-parts":[[2022,9,21]]},"end":{"date-parts":[[2022,9,23]]}},"container-title":["2022 International Conference on IC Design and Technology (ICICDT)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9933043\/9933065\/09933131.pdf?arnumber=9933131","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,11,28]],"date-time":"2022-11-28T20:19:36Z","timestamp":1669666776000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9933131\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,9,21]]},"references-count":26,"URL":"https:\/\/doi.org\/10.1109\/icicdt56182.2022.9933131","relation":{},"subject":[],"published":{"date-parts":[[2022,9,21]]}}}