{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T07:27:50Z","timestamp":1725694070069},"reference-count":16,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,9,25]],"date-time":"2023-09-25T00:00:00Z","timestamp":1695600000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,9,25]],"date-time":"2023-09-25T00:00:00Z","timestamp":1695600000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,9,25]]},"DOI":"10.1109\/icicdt59917.2023.10332358","type":"proceedings-article","created":{"date-parts":[[2023,12,6]],"date-time":"2023-12-06T18:24:27Z","timestamp":1701887067000},"page":"34-36","source":"Crossref","is-referenced-by-count":0,"title":["Insight into Effects of Introducing Ag-In-Zn-S Quantum Dots on Switching Characteristics of TiO<sub>2<\/sub>-Based Memristor"],"prefix":"10.1109","author":[{"given":"Nan","family":"He","sequence":"first","affiliation":[{"name":"Nanjing University of Posts and Telecommunications,College of Electronic and Optical Engineering &#x0026; College of Flexible Electronics (Future Technology),Nanjing,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Haiming","family":"Qin","sequence":"additional","affiliation":[{"name":"Nanjing University of Posts and Telecommunications,College of Integrated Circuit Science and Engineering,Nanjing,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Feng","family":"Xu","sequence":"additional","affiliation":[{"name":"Nanjing University of Posts and Telecommunications,College of Electronic and Optical Engineering &#x0026; College of Flexible Electronics (Future Technology),Nanjing,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Zhang","sequence":"additional","affiliation":[{"name":"Suzhou Laboratory,Suzhou,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yang","family":"Sheng","sequence":"additional","affiliation":[{"name":"Changzhou University,Jiangsu Key Laboratory of Environmentally Friendly Polymeric Materials, School of Materials Science and Engineering,Changzhou,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yi","family":"Tong","sequence":"additional","affiliation":[{"name":"Suzhou Laboratory,Suzhou,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1002\/smll.202300223"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1063\/5.0053702"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2021.3049676"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-023-39430-4"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1002\/aelm.202201093"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2023.3249137"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1039\/C5CP01235J"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2016.07.216"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202002948"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201805284"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1021\/am400168m"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1039\/D0NR02894K"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1063\/5.0039654"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1021\/acsanm.0c03180"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1103\/physrevapplied.17.034007"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1002\/aelm.202201038"}],"event":{"name":"2023 International Conference on IC Design and Technology (ICICDT)","start":{"date-parts":[[2023,9,25]]},"location":"Tokyo, Japan","end":{"date-parts":[[2023,9,28]]}},"container-title":["2023 International Conference on IC Design and Technology (ICICDT)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10332255\/10332256\/10332358.pdf?arnumber=10332358","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,12,19]],"date-time":"2023-12-19T23:38:48Z","timestamp":1703029128000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10332358\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9,25]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/icicdt59917.2023.10332358","relation":{},"subject":[],"published":{"date-parts":[[2023,9,25]]}}}