{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,6]],"date-time":"2026-06-06T16:29:51Z","timestamp":1780763391737,"version":"3.54.1"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,9,25]],"date-time":"2023-09-25T00:00:00Z","timestamp":1695600000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,9,25]],"date-time":"2023-09-25T00:00:00Z","timestamp":1695600000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100018542","name":"Natural Science Foundation of Sichuan Province","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100018542","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,9,25]]},"DOI":"10.1109\/icicdt59917.2023.10332378","type":"proceedings-article","created":{"date-parts":[[2023,12,6]],"date-time":"2023-12-06T18:24:27Z","timestamp":1701887067000},"page":"120-123","source":"Crossref","is-referenced-by-count":1,"title":["Systematic Study on Predicting the Lifetime of Si pMOSFETs During NBTI Stress Based on Low-Frequency Noise"],"prefix":"10.1109","author":[{"given":"Yi","family":"Jiang","sequence":"first","affiliation":[{"name":"Zhejiang University,School of Micro- and Nano-Electronics,Hangzhou,China,310000"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yanning","family":"Chen","sequence":"additional","affiliation":[{"name":"Beijing Smartchip Microelectronics Technology Co., Ltd,Beijing,China,100000"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Fang","family":"Liu","sequence":"additional","affiliation":[{"name":"Beijing Smartchip Microelectronics Technology Co., Ltd,Beijing,China,100000"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bo","family":"Wu","sequence":"additional","affiliation":[{"name":"Beijing Smartchip Microelectronics Technology Co., Ltd,Beijing,China,100000"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yongfeng","family":"Deng","sequence":"additional","affiliation":[{"name":"Beijing Smartchip Microelectronics Technology Co., Ltd,Beijing,China,100000"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Junkang","family":"Li","sequence":"additional","affiliation":[{"name":"Zhejiang University,School of Micro- and Nano-Electronics,Hangzhou,China,310000"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dawei","family":"Gao","sequence":"additional","affiliation":[{"name":"Zhejiang University,School of Micro- and Nano-Electronics,Hangzhou,China,310000"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Rui","family":"Zhang","sequence":"additional","affiliation":[{"name":"Zhejiang University,School of Micro- and Nano-Electronics,Hangzhou,China,310000"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/s0026-2714(00)00198-0"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/s0038-1101(01)00102-2"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/s0928-4931(01)00419-2"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1002\/9780470455265"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/jeds.2018.2855432"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1063\/1.1567461"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/iedm.1983.190525"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1002\/adma.202001227"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1002\/adom.202000191"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1021\/acs.nanolett.9b00908"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/16.47770"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/iedm.2008.4796625"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2002.802640"}],"event":{"name":"2023 International Conference on IC Design and Technology (ICICDT)","location":"Tokyo, Japan","start":{"date-parts":[[2023,9,25]]},"end":{"date-parts":[[2023,9,28]]}},"container-title":["2023 International Conference on IC Design and Technology (ICICDT)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10332255\/10332256\/10332378.pdf?arnumber=10332378","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,12,19]],"date-time":"2023-12-19T22:17:33Z","timestamp":1703024253000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10332378\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9,25]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/icicdt59917.2023.10332378","relation":{},"subject":[],"published":{"date-parts":[[2023,9,25]]}}}