{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T13:33:49Z","timestamp":1725716029193},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,12]]},"DOI":"10.1109\/iciinfs.2018.8721424","type":"proceedings-article","created":{"date-parts":[[2019,5,27]],"date-time":"2019-05-27T19:39:56Z","timestamp":1558985996000},"page":"333-338","source":"Crossref","is-referenced-by-count":3,"title":["Sample based SVM technique suitable for digital implementation of any level Modular Multilevel converter"],"prefix":"10.1109","author":[{"given":"Rupak","family":"Chakraborty","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Anubrata","family":"Dey","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2016.2514346"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS.2016.7870123"},{"key":"ref12","article-title":"Control of Modular Multilevel Converters Using an Overlapping Multi-Hexagon Space Vector Modulation Scheme","author":"oghorada","year":"0","journal-title":"IEEE Journal of Emerging and Selected Topics in Power Electronics"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2429595"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2293734"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2747584"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/CPE.2017.7915160"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1049\/iet-pel.2012.0527"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICIEA.2009.5138833"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.2011.6119421"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2017.2697953"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2532386"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.2015.7392704"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.2017.8216768"},{"key":"ref2","first-page":"1","article-title":"Modular Multilevel Converter - Impact on future applications and semiconductors","author":"marquardt","year":"2017","journal-title":"Power Electronic Components and their Applications 2017 7 ETG-Symposium PECA"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/PTC.2003.1304403"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2018.2812142"}],"event":{"name":"2018 IEEE 13th International Conference on Industrial and Information Systems (ICIIS)","start":{"date-parts":[[2018,12,1]]},"location":"Rupnagar, India","end":{"date-parts":[[2018,12,2]]}},"container-title":["2018 IEEE 13th International Conference on Industrial and Information Systems (ICIIS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8716289\/8721308\/08721424.pdf?arnumber=8721424","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,6,25]],"date-time":"2019-06-25T14:13:47Z","timestamp":1561472027000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8721424\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,12]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/iciinfs.2018.8721424","relation":{},"subject":[],"published":{"date-parts":[[2018,12]]}}}