{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T00:44:43Z","timestamp":1730249083132,"version":"3.28.0"},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,12]]},"DOI":"10.1109\/icm.2017.8268831","type":"proceedings-article","created":{"date-parts":[[2018,1,30]],"date-time":"2018-01-30T21:05:26Z","timestamp":1517346326000},"page":"1-5","source":"Crossref","is-referenced-by-count":2,"title":["Investigating the effect of the density of phase change materials on cooling electronic packages"],"prefix":"10.1109","author":[{"given":"Hussein","family":"Farhat","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ibrahim","family":"Mjallal","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mohammad","family":"Hammoud","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Samer","family":"Ali","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ali","family":"Al Shaer","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ali","family":"Assi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ibrahim","family":"Assi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2007.06.010"},{"key":"ref3","first-page":"442","article-title":"The use of heat pipes in personal computers","author":"ali","year":"0","journal-title":"Thermal and Thermomechanical Phenomena in Electronic Systems 1998 ITHERM'98 The Sixth Intersociety Conference on"},{"journal-title":"Power Electronics Circuits Devices and Applications","year":"2009","author":"rashid","key":"ref10"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijrefrig.2004.03.015"},{"key":"ref5","first-page":"22","article-title":"Advances in high-performance cooling for electronics","volume":"11","author":"lasance","year":"2005","journal-title":"Electronics Cooling"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/S0017-9310(98)00265-8"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/EDL.1981.25367"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2010.5457228"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.3390\/app6090226"},{"journal-title":"Reliability Prediction of Electronic Equipment","year":"1974","key":"ref1"}],"event":{"name":"2017 29th International Conference on Microelectronics (ICM)","start":{"date-parts":[[2017,12,10]]},"location":"Beirut, Lebanon","end":{"date-parts":[[2017,12,13]]}},"container-title":["2017 29th International Conference on Microelectronics (ICM)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8255703\/8268805\/08268831.pdf?arnumber=8268831","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,2,8]],"date-time":"2018-02-08T02:43:54Z","timestamp":1518057834000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8268831\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,12]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/icm.2017.8268831","relation":{},"subject":[],"published":{"date-parts":[[2017,12]]}}}