{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,17]],"date-time":"2026-04-17T01:51:55Z","timestamp":1776390715520,"version":"3.51.2"},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,12]]},"DOI":"10.1109\/icm.2018.8704077","type":"proceedings-article","created":{"date-parts":[[2019,5,2]],"date-time":"2019-05-02T18:49:41Z","timestamp":1556822981000},"page":"323-326","source":"Crossref","is-referenced-by-count":7,"title":["Design of an Advanced System-on-Chip Architecture for Internet-Enabled Smart Mobile Devices"],"prefix":"10.1109","author":[{"given":"Mohammed S.","family":"BenSaleh","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Syed Manzoor","family":"Qasim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Abdullah A.","family":"AlJuffri","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Abdulfattah M.","family":"Oheid","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","article-title":"Platform system architecture for designing mobile internet device SoCs","author":"bensaleh","year":"2018","journal-title":"Proc of IEEE Int Conf Electrical Electronics Computers Communication Mechanical and Computing (EECCMC)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1142\/S0218126611008055"},{"key":"ref6","first-page":"1","article-title":"Soft machines targets IPC bottleneck: new CPU approach boosts performance using virtual cores","author":"gwennap","year":"2014","journal-title":"Microprocessor Report The Linley Group"},{"key":"ref5","article-title":"A breakthrough new CPU architecture revives IPC scaling","author":"abdallah","year":"2014","journal-title":"Linley Processor Conference"},{"key":"ref7","article-title":"Mentor A Siemens business, Veloce Emulation Platform","year":"0"},{"key":"ref2","article-title":"International Technology Roadmap for Semiconductors: ITRS","year":"2017"},{"key":"ref1","article-title":"System on Chip (SoC) Market (Type-Digital, Analog, and Mixed Signal; Application-Telecommunication, Consumer Electronics, and Automotive)-Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017-2025","year":"0"}],"event":{"name":"2018 30th International Conference on Microelectronics (ICM)","location":"Sousse, Tunisia","start":{"date-parts":[[2018,12,16]]},"end":{"date-parts":[[2018,12,19]]}},"container-title":["2018 30th International Conference on Microelectronics (ICM)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8698775\/8703878\/08704077.pdf?arnumber=8704077","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,5,20]],"date-time":"2019-05-20T18:54:02Z","timestamp":1558378442000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8704077\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,12]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/icm.2018.8704077","relation":{},"subject":[],"published":{"date-parts":[[2018,12]]}}}