{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,19]],"date-time":"2025-09-19T11:14:54Z","timestamp":1758280494046},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,12,4]],"date-time":"2022-12-04T00:00:00Z","timestamp":1670112000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,12,4]],"date-time":"2022-12-04T00:00:00Z","timestamp":1670112000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,12,4]]},"DOI":"10.1109\/icm56065.2022.10005514","type":"proceedings-article","created":{"date-parts":[[2023,1,9]],"date-time":"2023-01-09T16:26:34Z","timestamp":1673281594000},"page":"30-33","source":"Crossref","is-referenced-by-count":12,"title":["Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM)"],"prefix":"10.1109","author":[{"given":"Aziz","family":"Oukaira","sequence":"first","affiliation":[{"name":"Université du Québec en Outaouais,Departement of Electrical and Computer Engineering,Gatineau,Canada,J8Y 3G5"}]},{"given":"Dhaou","family":"Said","sequence":"additional","affiliation":[{"name":"Université de Sherbrooke,Departement of Electrical and Computer Engineering,Sherbrooke,Canada,J1K 2R1"}]},{"given":"Jamal","family":"Zbitou","sequence":"additional","affiliation":[{"name":"University of Abdelmalek Essaadi,LABTIC, ENSA of Tangier,Tangier,Morocco,BP 1818"}]},{"given":"Ahmed","family":"Lakhssassi","sequence":"additional","affiliation":[{"name":"Université du Québec en Outaouais,Departement of Electrical and Computer Engineering,Gatineau,Canada,J8Y 3G5"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2005.1564736"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.3390\/s20195657"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2002.1012523"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/95.588564"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/SEGE.2017.8052803"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/NEWCAS50681.2021.9462767"},{"journal-title":"version 5 5 COMSOL Inc","article-title":"COMSOL Multiphysics","year":"2020","key":"ref10"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/NEWCAS.2017.8010162"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2004.828817"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2004.830354"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.procs.2019.08.015"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS47672.2021.9531747"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.3390\/s22155904"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2006.359836"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijthermalsci.2014.08.012"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2014.2334321"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2014.2312136"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2009.2020916"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.877252"},{"key":"ref6","first-page":"66","article-title":"System-level thermal modeling using nonconformal domain decomposition and model-order reduction","author":"xie","year":"2014","journal-title":"IEEE Trans Compon Packag Technol"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2101770"}],"event":{"name":"2022 International Conference on Microelectronics (ICM)","start":{"date-parts":[[2022,12,4]]},"location":"Casablanca, Morocco","end":{"date-parts":[[2022,12,7]]}},"container-title":["2022 International Conference on Microelectronics (ICM)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10005313\/10005321\/10005514.pdf?arnumber=10005514","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,2,7]],"date-time":"2023-02-07T14:14:34Z","timestamp":1675779274000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10005514\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,12,4]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/icm56065.2022.10005514","relation":{},"subject":[],"published":{"date-parts":[[2022,12,4]]}}}