{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,18]],"date-time":"2025-11-18T09:31:56Z","timestamp":1763458316595,"version":"3.28.0"},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,12,17]],"date-time":"2023-12-17T00:00:00Z","timestamp":1702771200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,12,17]],"date-time":"2023-12-17T00:00:00Z","timestamp":1702771200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,12,17]]},"DOI":"10.1109\/icm60448.2023.10378886","type":"proceedings-article","created":{"date-parts":[[2024,1,5]],"date-time":"2024-01-05T19:29:06Z","timestamp":1704482946000},"page":"298-303","source":"Crossref","is-referenced-by-count":1,"title":["A Novel Architecture of CXL Protocol Data Link Layer for Low Latency Memory Access"],"prefix":"10.1109","author":[{"given":"Basma H.","family":"Mohamed","sequence":"first","affiliation":[{"name":"Ain Shams University,Computer and Systems Engineering Dept.,Cairo,Egypt"}]},{"given":"Esmail","family":"Hany","sequence":"additional","affiliation":[{"name":"Siemens EDA, Cairo, Egypt,Cairo,Egypt"}]},{"given":"Mahmoud","family":"El-Tahawy","sequence":"additional","affiliation":[{"name":"Siemens EDA, Cairo, Egypt,Cairo,Egypt"}]},{"given":"Mohamed","family":"Abdel-Salam","sequence":"additional","affiliation":[{"name":"Siemens EDA, Cairo, Egypt,Cairo,Egypt"}]},{"given":"M. Watheq","family":"El-Kharashi","sequence":"additional","affiliation":[{"name":"Ain Shams University,Computer and Systems Engineering Dept.,Cairo,Egypt"}]},{"given":"Mona","family":"Safar","sequence":"additional","affiliation":[{"name":"Ain Shams University,Computer and Systems Engineering Dept.,Cairo,Egypt"}]}],"member":"263","reference":[{"key":"ref1","article-title":"United Microelectronics Corporation","volume":"1980","author":"Tsao","year":"2023"},{"article-title":"Taiwan Semicomductors Manufactor Company","year":"1987","author":"Institute","key":"ref2"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18072.2020.9218687"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1186\/s40537-019-0265-5"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830265"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.3403\/02270204u"},{"article-title":"Open-CAPI Specifications","year":"2017","author":"Consortium","key":"ref7"},{"article-title":"CCIX Specifications","year":"2017","author":"Consortium","key":"ref8"},{"article-title":"Compute Express Link Specification, Revision 2. 0","year":"2023","author":"Consortium","key":"ref9"},{"article-title":"OpenCAPI: Overview and Comparison-Youtube","year":"2017","author":"GEN-Z","key":"ref10"},{"article-title":"CCIX-Youtube","year":"2023","author":"Vs","key":"ref11"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/HCS55958.2022.9895633"},{"article-title":"CXL Consortium. Compute Express Link2.0 White Paper","year":"2020","author":"Das Sharma","key":"ref13"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.memori.2023.100051"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1007\/978-981-99-4764-5_18"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/HOTI55740.2022.00017"},{"article-title":"Compute Express Link (CXL)","year":"2019","author":"Inc","key":"ref19"},{"article-title":"Design Compiler tool","year":"1986","author":"Inc","key":"ref21"},{"journal-title":"Oasys","year":"1981","author":"Siemens","key":"ref22"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ICEEE.2004.1433851"},{"volume-title":"LINK LEVEL RETRY SCHEME","year":"2006","author":"Chou","key":"ref25"}],"event":{"name":"2023 International Conference on Microelectronics (ICM)","start":{"date-parts":[[2023,12,17]]},"location":"Abu Dhabi, United Arab Emirates","end":{"date-parts":[[2023,12,20]]}},"container-title":["2023 International Conference on Microelectronics (ICM)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10378847\/10378878\/10378886.pdf?arnumber=10378886","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T05:22:47Z","timestamp":1706073767000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10378886\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,12,17]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/icm60448.2023.10378886","relation":{},"subject":[],"published":{"date-parts":[[2023,12,17]]}}}