{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T20:16:34Z","timestamp":1725653794210},"reference-count":20,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,5,24]],"date-time":"2022-05-24T00:00:00Z","timestamp":1653350400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,5,24]],"date-time":"2022-05-24T00:00:00Z","timestamp":1653350400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,5,24]]},"DOI":"10.1109\/icps51978.2022.9816887","type":"proceedings-article","created":{"date-parts":[[2022,7,18]],"date-time":"2022-07-18T20:45:34Z","timestamp":1658177134000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Improving wafer map classification in Industry 4.0"],"prefix":"10.1109","author":[{"given":"Michael","family":"Scheiber","sequence":"first","affiliation":[{"name":"KAI GmbH,Villach,Austria"}]},{"given":"Clement","family":"Nartey","sequence":"additional","affiliation":[{"name":"Flextronics International GmbH,Althofen,Austria"}]},{"given":"Anja","family":"Zernig","sequence":"additional","affiliation":[{"name":"KAI GmbH,Villach,Austria"}]},{"given":"Andre","family":"Kaestner","sequence":"additional","affiliation":[{"name":"Infineon Technologies Austria AG,Villach,Austria"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/SMC.2019.8914309"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.aei.2020.101101"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICPS49255.2021.9468145"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/NOMS47738.2020.9110365"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1201\/9781315367897"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2015.2497264"},{"key":"ref16","article-title":"Pattern Recognition in Analog Wafer Test Data - A Health Factor for Process Patterns","author":"schrunner","year":"2019","journal-title":"Ph D dissertation Graz University of Technology Graz Austria"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2020.3020985"},{"journal-title":"Simulated analog wafer test data for pattern recognition","year":"2019","author":"pleschberger","key":"ref18"},{"key":"ref19","first-page":"1","article-title":"Guidelines for part average testing","author":"haifley","year":"2011","journal-title":"Automotive Electronics Council"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TNSE.2021.3103602"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ICPS49255.2021.9468218"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.cie.2018.04.024"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2021.3050733"},{"journal-title":"European investment for Dig-italisation and Automation Leadership","year":"2019","key":"ref8"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/3433210.3437513"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/CBI52690.2021.10051"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICPHYS.2019.8780171"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICPHYS.2019.8780144"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1007\/s11265-019-01470-9"}],"event":{"name":"2022 IEEE 5th International Conference on Industrial Cyber-Physical Systems (ICPS)","start":{"date-parts":[[2022,5,24]]},"location":"Coventry, United Kingdom","end":{"date-parts":[[2022,5,26]]}},"container-title":["2022 IEEE 5th International Conference on Industrial Cyber-Physical Systems (ICPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9816848\/9816852\/09816887.pdf?arnumber=9816887","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,8,8]],"date-time":"2022-08-08T20:01:18Z","timestamp":1659988878000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9816887\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,5,24]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/icps51978.2022.9816887","relation":{},"subject":[],"published":{"date-parts":[[2022,5,24]]}}}