{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T02:27:51Z","timestamp":1730255271650,"version":"3.28.0"},"reference-count":23,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,5,8]],"date-time":"2023-05-08T00:00:00Z","timestamp":1683504000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,5,8]],"date-time":"2023-05-08T00:00:00Z","timestamp":1683504000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,5,8]]},"DOI":"10.1109\/icps58381.2023.10128064","type":"proceedings-article","created":{"date-parts":[[2023,5,24]],"date-time":"2023-05-24T17:29:30Z","timestamp":1684949370000},"page":"1-6","source":"Crossref","is-referenced-by-count":3,"title":["Bayesian Optimized Autoencoder for Predictive Maintenance of Smart Packaging Machines"],"prefix":"10.1109","author":[{"given":"Murshedul","family":"Arifeen","sequence":"first","affiliation":[{"name":"School of Computing Robert Gordon University,Aberdeen,Scotland"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Andrei","family":"Petrovski","sequence":"additional","affiliation":[{"name":"School of Computing Robert Gordon University,Aberdeen,Scotland"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2019.2949355"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1504\/IJHM.2021.114174"},{"journal-title":"Automotive electronics council (aec) internet draft","year":"2011","key":"ref23"},{"key":"ref15","article-title":"Practical bayesian optimization of machine learning algorithms","volume":"25","author":"snoek","year":"2012","journal-title":"Advances in neural information processing systems"},{"journal-title":"Webpage","article-title":"liot or industry 4. 0-shrink wrapper-concept","year":"2020","key":"ref14"},{"journal-title":"Vega shrink-wrapper component degradation","year":"2018","key":"ref20"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-019-04788-7"},{"journal-title":"The Automotive Electronics Council (AEC)","year":"2021","key":"ref22"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.wear.2021.203902"},{"journal-title":"Machine Learning Glossary","year":"2017","key":"ref21"},{"journal-title":"Webpage","article-title":"Top ten packaging equipment manufacturing companies","year":"2020","key":"ref2"},{"key":"ref1","article-title":"How does the packaging industry work?","author":"may","year":"2023","journal-title":"Webpage"},{"key":"ref17","article-title":"Autocncoders","author":"bank","year":"2020","journal-title":"ArXiv Preprint"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/AIKE.2019.00060"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.iot.2022.100575"},{"key":"ref18","article-title":"An introduction to autoencoders","author":"michelucci","year":"2022","journal-title":"ArXiv Preprint"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/3377049.3377054"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/SIN54109.2021.9699232"},{"journal-title":"Webpage","article-title":"Schneider electric packaging automation solutions","year":"2023","key":"ref9"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.procir.2018.03.150"},{"key":"ref3","article-title":"2022 and beyond for the packaging industry's ceos: The priorities for resilience","author":"feber","year":"2022","journal-title":"Webpage"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/s40747-020-00267-9"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-020-05449-w"}],"event":{"name":"2023 IEEE 6th International Conference on Industrial Cyber-Physical Systems (ICPS)","start":{"date-parts":[[2023,5,8]]},"location":"Wuhan, China","end":{"date-parts":[[2023,5,11]]}},"container-title":["2023 IEEE 6th International Conference on Industrial Cyber-Physical Systems (ICPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10127967\/10127864\/10128064.pdf?arnumber=10128064","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,12]],"date-time":"2023-06-12T17:54:44Z","timestamp":1686592484000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10128064\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,5,8]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/icps58381.2023.10128064","relation":{},"subject":[],"published":{"date-parts":[[2023,5,8]]}}}