{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T08:42:09Z","timestamp":1725439329621},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,10]]},"DOI":"10.1109\/icsens.2016.7808978","type":"proceedings-article","created":{"date-parts":[[2017,1,11]],"date-time":"2017-01-11T18:14:24Z","timestamp":1484158464000},"page":"1-3","source":"Crossref","is-referenced-by-count":0,"title":["Force impact effect in contact-mode triboelectric energy harvesters: Characterization and modeling"],"prefix":"10.1109","author":[{"given":"Marco","family":"Lasagni","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Paolo","family":"Pavan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alessandro","family":"Bertacchini","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Luca","family":"Larcher","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/AIM.2015.7222595"},{"key":"ref3","first-page":"8.3.1","article-title":"Comprehensive analysis of deformation of interfacial micronano structure by applied force in triboelectric energy harvester","author":"seol","year":"2014","journal-title":"Proc IEEE IEDM"},{"key":"ref6","first-page":"1151","article-title":"Ultra low cost triboelectric energy harvesting solutions for embedded seasor systems","author":"bertacchini","year":"2015","journal-title":"Proc IEEE-NANO"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.ces.2010.07.005"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICSENS.2015.7370232"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1039\/c3ee42571a"}],"event":{"name":"2016 IEEE SENSORS","start":{"date-parts":[[2016,10,30]]},"location":"Orlando, FL, USA","end":{"date-parts":[[2016,11,3]]}},"container-title":["2016 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7777313\/7808393\/07808978.pdf?arnumber=7808978","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,1,20]],"date-time":"2017-01-20T07:01:53Z","timestamp":1484895713000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7808978\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,10]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/icsens.2016.7808978","relation":{},"subject":[],"published":{"date-parts":[[2016,10]]}}}