{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T03:09:12Z","timestamp":1730257752331,"version":"3.28.0"},"reference-count":18,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,10]]},"DOI":"10.1109\/icsens.2018.8589859","type":"proceedings-article","created":{"date-parts":[[2019,1,18]],"date-time":"2019-01-18T22:13:44Z","timestamp":1547849624000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Multilayer Electrical Capacitance Tomography Sensor Structure 3D-Printing"],"prefix":"10.1109","author":[{"given":"Aleksandra","family":"Kowalska","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Robert","family":"Banasiak","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Radoslaw","family":"Wajman","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Andrzej","family":"Romanowski","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dominik","family":"Sankowski","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","article-title":"Big data-driven contextual processing methods for electrical capacitance tomography","author":"romanowski","year":"2018","journal-title":"IEEE Transactions on Industrial Informatics"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2017.2707538"},{"key":"ref12","article-title":"Study of granular flow in silo based on electrical capacitance tomography and optical imaging","author":"grudzien","year":"2017","journal-title":"Flow Measurement and Instrumentation"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1080\/02726350701759373"},{"key":"ref14","first-page":"16131619","article-title":"Design of crowdsourcing system for analysis of gravitational flow using x-ray visualization","volume":"8","author":"jelliti","year":"2016","journal-title":"FedCSIS"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1002\/apj.2177"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.flowmeasinst.2016.12.010"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2017.2746748"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/2897370"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.2528\/PIER09111201"},{"key":"ref3","first-page":"942","article-title":"Development of 3-dimensional electrical capacitance tomography based on neural network multi-criterion optimization image reconstruction","author":"warsito","year":"2003","journal-title":"Proc of 3rd World Congress on Industrial Process Tomography"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IIPHDW.2018.8388365"},{"key":"ref5","doi-asserted-by":"crossref","first-page":"1890","DOI":"10.3390\/s100301890","article-title":"Electrical capacitance volume tomography: Design and applications","volume":"10","author":"wang","year":"2019","journal-title":"SENSORS"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1002\/ppsc.200601059"},{"key":"ref7","first-page":"14","article-title":"Control of Pneumatic Conveying Using ECT","author":"neuffer","year":"1999","journal-title":"1st World Congress on Industrial Process Tomography"},{"key":"ref2","first-page":"2113","article-title":"Spatial imaging with 3D capacitance measurements. Measurement","volume":"17","author":"wajman","year":"2006","journal-title":"Science and Technology"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1784\/insi.2006.48.10.613"},{"key":"ref9","first-page":"291","article-title":"Contextual processing of ECT measurement information towardsdetection of process emergency states","author":"romanowski","year":"2013","journal-title":"Hybrid Intelligent Systems (HIS) 2013 13th International Conference on"}],"event":{"name":"2018 IEEE Sensors","start":{"date-parts":[[2018,10,28]]},"location":"New Delhi","end":{"date-parts":[[2018,10,31]]}},"container-title":["2018 IEEE SENSORS"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8572682\/8589503\/08589859.pdf?arnumber=8589859","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,8,24]],"date-time":"2020-08-24T01:43:05Z","timestamp":1598233385000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8589859\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,10]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/icsens.2018.8589859","relation":{},"subject":[],"published":{"date-parts":[[2018,10]]}}}