{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T03:43:43Z","timestamp":1730259823387,"version":"3.28.0"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,11,23]],"date-time":"2020-11-23T00:00:00Z","timestamp":1606089600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,11,23]],"date-time":"2020-11-23T00:00:00Z","timestamp":1606089600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,11,23]],"date-time":"2020-11-23T00:00:00Z","timestamp":1606089600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,11,23]]},"DOI":"10.1109\/icta50426.2020.9331982","type":"proceedings-article","created":{"date-parts":[[2021,2,2]],"date-time":"2021-02-02T16:33:39Z","timestamp":1612283619000},"page":"119-120","source":"Crossref","is-referenced-by-count":0,"title":["Design and Development for CIS-WLCSP Using Vertical TSV Technology"],"prefix":"10.1109","author":[{"given":"Tianshen","family":"Zhou","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shuying","family":"Ma","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tao","family":"Hang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ming","family":"Xiang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2009.2026950"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2009.4977515"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2008.4550028"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/CSTIC.2015.7153436"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-016-3267-7"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490913"},{"key":"ref1","first-page":"68","article-title":"Cramming more components onto integrated circuits[J]","volume":"2","author":"moore","year":"1965","journal-title":"J Clerk Maxwell a Treatise on Electricity and Magnetism"}],"event":{"name":"2020 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","start":{"date-parts":[[2020,11,23]]},"location":"Nanjing, China","end":{"date-parts":[[2020,11,25]]}},"container-title":["2020 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9331933\/9331955\/09331982.pdf?arnumber=9331982","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,27]],"date-time":"2022-06-27T20:09:31Z","timestamp":1656360571000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9331982\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,11,23]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/icta50426.2020.9331982","relation":{},"subject":[],"published":{"date-parts":[[2020,11,23]]}}}