{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T23:30:09Z","timestamp":1725579009061},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,11,24]],"date-time":"2021-11-24T00:00:00Z","timestamp":1637712000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,11,24]],"date-time":"2021-11-24T00:00:00Z","timestamp":1637712000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,11,24]],"date-time":"2021-11-24T00:00:00Z","timestamp":1637712000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,11,24]]},"DOI":"10.1109\/icta53157.2021.9661693","type":"proceedings-article","created":{"date-parts":[[2022,1,3]],"date-time":"2022-01-03T15:19:29Z","timestamp":1641223169000},"page":"201-203","source":"Crossref","is-referenced-by-count":0,"title":["Direct Cu-polyimide Bonding Achieved by Surface Activation and Pt-catalyzed Formic Acid Atmosphere"],"prefix":"10.1109","author":[{"given":"Ying","family":"Meng","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Runhua","family":"Gao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xinhua","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaojuan","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sen","family":"Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ke","family":"Wei","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dahai","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fengwen","family":"Mu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xinyu","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1295\/polymj.PJ2006099"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2928620"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2016.7583247"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2102352"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1021\/acs.langmuir.6b01657"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.9b10106"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.3938\/jkps.52.1673"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1039\/C2LC41014A"},{"key":"ref9","first-page":"1","article-title":"Interfacial transformation of preoxidized Cu microparticles in a formicacid atmosphere for pressureless Cu–Cu bonding","author":"gao","year":"2020","journal-title":"Journal of Materials Science Materials in Electronics"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1039\/b517055a"}],"event":{"name":"2021 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","start":{"date-parts":[[2021,11,24]]},"location":"Zhuhai, China","end":{"date-parts":[[2021,11,26]]}},"container-title":["2021 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9661584\/9661598\/09661693.pdf?arnumber=9661693","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T12:56:43Z","timestamp":1652187403000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9661693\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,11,24]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/icta53157.2021.9661693","relation":{},"subject":[],"published":{"date-parts":[[2021,11,24]]}}}