{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T01:14:56Z","timestamp":1740100496779,"version":"3.37.3"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,11,24]],"date-time":"2021-11-24T00:00:00Z","timestamp":1637712000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,11,24]],"date-time":"2021-11-24T00:00:00Z","timestamp":1637712000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,11,24]],"date-time":"2021-11-24T00:00:00Z","timestamp":1637712000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100007957","name":"Chongqing Municipal Education Commission","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100007957","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002369","name":"Chongqing University","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100002369","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,11,24]]},"DOI":"10.1109\/icta53157.2021.9661776","type":"proceedings-article","created":{"date-parts":[[2022,1,3]],"date-time":"2022-01-03T20:19:29Z","timestamp":1641241169000},"page":"163-166","source":"Crossref","is-referenced-by-count":1,"title":["The effect of ultrasonic turn-on sequence for dual ultrasonicassisted soldering"],"prefix":"10.1109","author":[{"given":"Zhaoqi","family":"Jiang","sequence":"first","affiliation":[]},{"given":"Gui-Sheng","family":"Gan","sequence":"additional","affiliation":[]},{"given":"Shi-Qi","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Qianzhu","family":"Xu","sequence":"additional","affiliation":[]},{"given":"Tian","family":"Huang","sequence":"additional","affiliation":[]},{"given":"Cong","family":"Liu","sequence":"additional","affiliation":[]},{"given":"Peng","family":"Ma","sequence":"additional","affiliation":[]},{"given":"Hao","family":"Yang","sequence":"additional","affiliation":[]},{"given":"Siwen","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Yiping","family":"Wu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","first-page":"44","article-title":"Research on Ultrasonic-Assisted Low Temperature Brazing of SAC0307 Lead-Free Solder","volume":"29","author":"gan","year":"2019","journal-title":"Powder Metallurgy Industry"},{"key":"ref3","first-page":"1","article-title":"Research progress of ultrasonic assisted brazing technology","volume":"37","author":"li","year":"2013","journal-title":"Materials for Mechanical Engineering"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/S1003-6326(17)60112-2"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1007\/s40194-019-00815-z"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.3390\/met10020223"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/S1003-6326(11)60953-9"},{"key":"ref2","first-page":"101","article-title":"Ultrasonic-assisted brazing of copper\/aluminum dissimilar metal joint interface microstructure and performance and strengthening mechanism","volume":"36","author":"zhang","year":"2015","journal-title":"Transactions Of The China Welding Institution"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ultsonch.2016.06.031"}],"event":{"name":"2021 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","start":{"date-parts":[[2021,11,24]]},"location":"Zhuhai, China","end":{"date-parts":[[2021,11,26]]}},"container-title":["2021 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9661584\/9661598\/09661776.pdf?arnumber=9661776","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T16:56:43Z","timestamp":1652201803000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9661776\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,11,24]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/icta53157.2021.9661776","relation":{},"subject":[],"published":{"date-parts":[[2021,11,24]]}}}