{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T03:44:29Z","timestamp":1730259869935,"version":"3.28.0"},"reference-count":4,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,10,28]],"date-time":"2022-10-28T00:00:00Z","timestamp":1666915200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,28]],"date-time":"2022-10-28T00:00:00Z","timestamp":1666915200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,10,28]]},"DOI":"10.1109\/icta56932.2022.9963005","type":"proceedings-article","created":{"date-parts":[[2022,12,2]],"date-time":"2022-12-02T16:06:48Z","timestamp":1669997208000},"page":"17-19","source":"Crossref","is-referenced-by-count":0,"title":["Accurate 3DIC thermal simulation for BEOL influence study"],"prefix":"10.1109","author":[{"given":"Hao","family":"Yang","sequence":"first","affiliation":[{"name":"ZTE Corporation,Department of Packaging and Testing"}]},{"given":"Bin","family":"Yan","sequence":"additional","affiliation":[{"name":"ZTE Corporation,Department of Packaging and Testing"}]},{"given":"Jianjun","family":"Sur","sequence":"additional","affiliation":[{"name":"ZTE Corporation,Department of Packaging and Testing"}]},{"given":"Jian","family":"Pang","sequence":"additional","affiliation":[{"name":"ZTE Corporation,Department of Packaging and Testing"}]},{"given":"Guanavao","family":"Li","sequence":"additional","affiliation":[{"name":"ZTE Corporation,Department of Packaging and Testing"}]},{"given":"Ouvana","family":"Keqing","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Mobile Network and Mobile Multimedia Technology"}]},{"given":"Shuaiana","family":"Zhang","sequence":"additional","affiliation":[{"name":"Ansys"}]}],"member":"263","reference":[{"key":"ref4","article-title":"Full chip thermal analysis of planar (2-D) and vertically integrated (3-D) high performance ICs","volume":"2","author":"im","year":"0","journal-title":"International Electron Devices Meeting 2000 Technical Digest IEDM (Cat No 00CH37138) IEEE"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/THERMINIC.2018.8593284"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/EDAPS.2010.5683029"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1115\/IPACK2011-52240"}],"event":{"name":"2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","start":{"date-parts":[[2022,10,28]]},"location":"Xi'an, China","end":{"date-parts":[[2022,10,30]]}},"container-title":["2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9962812\/9962965\/09963005.pdf?arnumber=9963005","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,19]],"date-time":"2022-12-19T15:01:00Z","timestamp":1671462060000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9963005\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10,28]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/icta56932.2022.9963005","relation":{},"subject":[],"published":{"date-parts":[[2022,10,28]]}}}