{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,11,19]],"date-time":"2024-11-19T18:49:56Z","timestamp":1732042196441},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,10,28]],"date-time":"2022-10-28T00:00:00Z","timestamp":1666915200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,28]],"date-time":"2022-10-28T00:00:00Z","timestamp":1666915200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,10,28]]},"DOI":"10.1109\/icta56932.2022.9963070","type":"proceedings-article","created":{"date-parts":[[2022,12,2]],"date-time":"2022-12-02T21:06:48Z","timestamp":1670015208000},"page":"119-120","source":"Crossref","is-referenced-by-count":1,"title":["A Current Domain Computing-in-Memory SRAM Macro with Hybrid IAF-SAR ADC for Signal Margin Enhancement"],"prefix":"10.1109","author":[{"given":"Tianqi","family":"Xu","sequence":"first","affiliation":[{"name":"Shenzhen International Graduate School, Tsinghua University,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shumeng","family":"Li","sequence":"additional","affiliation":[{"name":"Shenzhen International Graduate School, Tsinghua University,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fukun","family":"Su","sequence":"additional","affiliation":[{"name":"Shenzhen International Graduate School, Tsinghua University,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xian","family":"Tang","sequence":"additional","affiliation":[{"name":"Shenzhen International Graduate School, Tsinghua University,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662435"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2019.2934831"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2744769.2744783"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3064189"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2952773"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3031290"}],"event":{"name":"2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","start":{"date-parts":[[2022,10,28]]},"location":"Xi'an, China","end":{"date-parts":[[2022,10,30]]}},"container-title":["2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9962812\/9962965\/09963070.pdf?arnumber=9963070","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,19]],"date-time":"2022-12-19T20:01:06Z","timestamp":1671480066000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9963070\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10,28]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/icta56932.2022.9963070","relation":{},"subject":[],"published":{"date-parts":[[2022,10,28]]}}}