{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T01:26:37Z","timestamp":1740101197362,"version":"3.37.3"},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,10,28]],"date-time":"2022-10-28T00:00:00Z","timestamp":1666915200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,28]],"date-time":"2022-10-28T00:00:00Z","timestamp":1666915200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2021YFB2206504"],"award-info":[{"award-number":["2021YFB2206504"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,10,28]]},"DOI":"10.1109\/icta56932.2022.9963090","type":"proceedings-article","created":{"date-parts":[[2022,12,2]],"date-time":"2022-12-02T21:06:48Z","timestamp":1670015208000},"page":"198-199","source":"Crossref","is-referenced-by-count":0,"title":["A 224-Gb\/s Inverter-Based TIA with Interleaved Active-Feedback and Distributed Peaking in 28-nm CMOS for Silicon Photonic Receivers"],"prefix":"10.1109","author":[{"given":"Sikai","family":"Chen","sequence":"first","affiliation":[{"name":"Lanzhou University,Lanzhou,China"}]},{"given":"Jintao","family":"Xue","sequence":"additional","affiliation":[{"name":"School of Future Technology, University of Chinese Academy of Sciences,Beijing,China"}]},{"given":"Leliang","family":"Li","sequence":"additional","affiliation":[{"name":"Institute of Semiconductors, Chinese Academy of Sciences,State Key Laboratory of Superlattices and Microstructures,Beijing,China"}]},{"given":"Guike","family":"Li","sequence":"additional","affiliation":[{"name":"Institute of Semiconductors, Chinese Academy of Sciences,State Key Laboratory of Superlattices and Microstructures,Beijing,China"}]},{"given":"Zhao","family":"Zhang","sequence":"additional","affiliation":[{"name":"Institute of Semiconductors, Chinese Academy of Sciences,State Key Laboratory of Superlattices and Microstructures,Beijing,China"}]},{"given":"Jian","family":"Liu","sequence":"additional","affiliation":[{"name":"Institute of Semiconductors, Chinese Academy of Sciences,State Key Laboratory of Superlattices and Microstructures,Beijing,China"}]},{"given":"Liyuan","family":"Liu","sequence":"additional","affiliation":[{"name":"Institute of Semiconductors, Chinese Academy of Sciences,State Key Laboratory of Superlattices and Microstructures,Beijing,China"}]},{"given":"Binhao","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Future Technology, University of Chinese Academy of Sciences,Beijing,China"}]},{"given":"Yingtao","family":"Li","sequence":"additional","affiliation":[{"name":"Lanzhou University,Lanzhou,China"}]},{"given":"Nan","family":"Qi","sequence":"additional","affiliation":[{"name":"Institute of Semiconductors, Chinese Academy of Sciences,State Key Laboratory of Superlattices and Microstructures,Beijing,China"}]}],"member":"263","reference":[{"key":"ref4","first-page":"1397","article-title":"A 128 Gb\/s, 11.2 mW Single-Ended PAM4 Linear TIA With 2.7 µArms Input Noise in 22 nm FinFET CMOS","volume":"57","author":"daneshgar","year":"2022","journal-title":"IEEE JSSC"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2804042"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICTA53157.2021.9661955"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2018.8494285"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/CICC53496.2022.9772827"}],"event":{"name":"2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","start":{"date-parts":[[2022,10,28]]},"location":"Xi'an, China","end":{"date-parts":[[2022,10,30]]}},"container-title":["2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9962812\/9962965\/09963090.pdf?arnumber=9963090","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,19]],"date-time":"2022-12-19T20:01:17Z","timestamp":1671480077000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9963090\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10,28]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/icta56932.2022.9963090","relation":{},"subject":[],"published":{"date-parts":[[2022,10,28]]}}}