{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T03:44:54Z","timestamp":1730259894445,"version":"3.28.0"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,27]]},"DOI":"10.1109\/icta60488.2023.10363780","type":"proceedings-article","created":{"date-parts":[[2023,12,28]],"date-time":"2023-12-28T19:21:00Z","timestamp":1703791260000},"page":"1-2","source":"Crossref","is-referenced-by-count":0,"title":["A FinFET Integrated STT-MRAM with Triple Balanced Access Strategy"],"prefix":"10.1109","author":[{"given":"Xinshu","family":"Xie","sequence":"first","affiliation":[{"name":"Southeast University,National ASIC System Engineering Center,Nanjing,China,210096"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jiongzhe","family":"Su","sequence":"additional","affiliation":[{"name":"Southeast University,National ASIC System Engineering Center,Nanjing,China,210096"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Zhang","sequence":"additional","affiliation":[{"name":"Nanjing Research Institute of Electronics Technology,Nanjing,China,210000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Cai","sequence":"additional","affiliation":[{"name":"Southeast University,National ASIC System Engineering Center,Nanjing,China,210096"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","first-page":"500","author":"Cai","year":"2023","journal-title":"IEEE ISSCC"},{"key":"ref2","first-page":"18.1.1","author":"Golonzka","year":"2018","journal-title":"IEEE IEDM"},{"key":"ref3","first-page":"1","author":"Kim","year":"2015","journal-title":"IEEE ISSCC"},{"issue":"1","key":"ref4","first-page":"122","volume":"64","author":"Kang","year":"2017","journal-title":"IEEE TCASI"},{"key":"ref5","first-page":"496","author":"Chiu","year":"2023","journal-title":"IEEE ISSCC"},{"key":"ref6","first-page":"1","author":"Zhang","year":"2021","journal-title":"IEEE ASICON"},{"issue":"9","key":"ref7","doi-asserted-by":"crossref","first-page":"1649","DOI":"10.1016\/j.microrel.2015.06.029","volume":"55","author":"Wang","year":"2015","journal-title":"Microelectron Reliab"},{"issue":"5","key":"ref8","first-page":"1625","volume":"67","author":"Zhou","year":"2020","journal-title":"IEEE TCASI"}],"event":{"name":"2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","start":{"date-parts":[[2023,10,27]]},"location":"Hefei, China","end":{"date-parts":[[2023,10,29]]}},"container-title":["2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10363774\/10363775\/10363780.pdf?arnumber=10363780","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T20:35:16Z","timestamp":1705091716000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10363780\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,27]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/icta60488.2023.10363780","relation":{},"subject":[],"published":{"date-parts":[[2023,10,27]]}}}