{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T09:14:53Z","timestamp":1725700493874},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,27]]},"DOI":"10.1109\/icta60488.2023.10363781","type":"proceedings-article","created":{"date-parts":[[2023,12,28]],"date-time":"2023-12-28T19:21:00Z","timestamp":1703791260000},"page":"1-2","source":"Crossref","is-referenced-by-count":0,"title":["Simple-Logic Comparator-Offset Mitigation Technique for Resistor-Based Temperature Sensor in DFLL"],"prefix":"10.1109","author":[{"given":"Dan","family":"Shi","sequence":"first","affiliation":[{"name":"University of Macau,State-Key Laboratory of Analog and Mixed-Signal VLSI and FST-ECE,Macau,China"}]},{"given":"Ka-Meng","family":"Lei","sequence":"additional","affiliation":[{"name":"University of Macau,State-Key Laboratory of Analog and Mixed-Signal VLSI and FST-ECE,Macau,China"}]},{"given":"Rui P.","family":"Martins","sequence":"additional","affiliation":[{"name":"University of Macau,State-Key Laboratory of Analog and Mixed-Signal VLSI and FST-ECE,Macau,China"}]},{"given":"Pui-In","family":"Mak","sequence":"additional","affiliation":[{"name":"University of Macau,State-Key Laboratory of Analog and Mixed-Signal VLSI and FST-ECE,Macau,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062956"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2019.2937441"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2871622"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2023.3269077"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICTA53157.2021.9661638"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2023.3289500"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3067051"}],"event":{"name":"2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","start":{"date-parts":[[2023,10,27]]},"location":"Hefei, China","end":{"date-parts":[[2023,10,29]]}},"container-title":["2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10363774\/10363775\/10363781.pdf?arnumber=10363781","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T22:50:04Z","timestamp":1705099804000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10363781\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,27]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/icta60488.2023.10363781","relation":{},"subject":[],"published":{"date-parts":[[2023,10,27]]}}}