{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,3]],"date-time":"2025-07-03T14:37:44Z","timestamp":1751553464951},"reference-count":17,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,27]]},"DOI":"10.1109\/icta60488.2023.10364251","type":"proceedings-article","created":{"date-parts":[[2023,12,28]],"date-time":"2023-12-28T14:21:00Z","timestamp":1703773260000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["INVITED PAPER: A 4.5-5.4GHz Digital Bang-Bang PLL for Cryogenic Applications"],"prefix":"10.1109","author":[{"given":"Haoyuan","family":"Gao","sequence":"first","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Xu","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xinyi","family":"Lin","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yan","family":"Liu","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhidong","family":"Tang","sequence":"additional","affiliation":[{"name":"ShanghaiTech University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xufeng","family":"Kou","sequence":"additional","affiliation":[{"name":"ShanghaiTech University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xingyu","family":"Zhang","sequence":"additional","affiliation":[{"name":"Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tetsuya","family":"Iizuka","sequence":"additional","affiliation":[{"name":"The University of Tokyo,Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Na","family":"Yan","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2016.2642207"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2020.2984280"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757387"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2682841"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3305604"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2679683"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3171498"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JEDS.2020.2976546"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.3043165"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2737549"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3174605"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3199997"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731542"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3223629"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3198663"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2704023"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2032723"}],"event":{"name":"2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","start":{"date-parts":[[2023,10,27]]},"location":"Hefei, China","end":{"date-parts":[[2023,10,29]]}},"container-title":["2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10363774\/10363775\/10364251.pdf?arnumber=10364251","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T18:04:33Z","timestamp":1705082673000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10364251\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,27]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/icta60488.2023.10364251","relation":{},"subject":[],"published":{"date-parts":[[2023,10,27]]}}}