{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,3]],"date-time":"2026-03-03T21:19:12Z","timestamp":1772572752652,"version":"3.50.1"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61904028"],"award-info":[{"award-number":["61904028"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,27]]},"DOI":"10.1109\/icta60488.2023.10364252","type":"proceedings-article","created":{"date-parts":[[2023,12,28]],"date-time":"2023-12-28T19:21:00Z","timestamp":1703791260000},"page":"1-2","source":"Crossref","is-referenced-by-count":2,"title":["Temperature-Adaptive MRAM Sensing Using Varied Magneto-Resistance"],"prefix":"10.1109","author":[{"given":"Jiongzhe","family":"Su","sequence":"first","affiliation":[{"name":"School of Integrated Circuits, Southeast University,Nanjing,China,210096"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Zhang","sequence":"additional","affiliation":[{"name":"Nanjing Research Institute of Electronics Technology,Nanjing,China,210000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Cai","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Southeast University,Nanjing,China,210096"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"issue":"4","key":"ref1","doi-asserted-by":"crossref","first-page":"1762","DOI":"10.1109\/TED.2016.2533438","volume":"63","author":"Wang","year":"2016","journal-title":"IEEE TED"},{"issue":"6","key":"ref2","doi-asserted-by":"crossref","first-page":"1505","DOI":"10.1109\/TVLSI.2020.2981443","volume":"28","author":"Qoutb","year":"2020","journal-title":"IEEE T-VLSI"},{"key":"ref3","first-page":"638","volume":"21","author":"Wu","year":"2022","journal-title":"IEEE Tnano"},{"key":"ref4","first-page":"1","author":"Wu","year":"2021","journal-title":"IEEE NANOARCH"},{"issue":"3","key":"ref5","first-page":"906","volume":"53","author":"Park","year":"2018","journal-title":"IEEE JSSC"},{"issue":"1","key":"ref6","first-page":"402","volume":"9","author":"Wang","year":"2021","journal-title":"IEEE TETC"},{"issue":"12","key":"ref7","first-page":"4635","volume":"39","author":"Sethuraman","year":"2020","journal-title":"IEEE TCAD"}],"event":{"name":"2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","location":"Hefei, China","start":{"date-parts":[[2023,10,27]]},"end":{"date-parts":[[2023,10,29]]}},"container-title":["2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10363774\/10363775\/10364252.pdf?arnumber=10364252","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T20:35:20Z","timestamp":1705091720000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10364252\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,27]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/icta60488.2023.10364252","relation":{},"subject":[],"published":{"date-parts":[[2023,10,27]]}}}