{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T09:22:25Z","timestamp":1725700945619},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,27]]},"DOI":"10.1109\/icta60488.2023.10364289","type":"proceedings-article","created":{"date-parts":[[2023,12,28]],"date-time":"2023-12-28T19:21:00Z","timestamp":1703791260000},"page":"188-189","source":"Crossref","is-referenced-by-count":0,"title":["MSeg-SLAM: A Semantic Visual SLAM System for Dynamic Scenes"],"prefix":"10.1109","author":[{"given":"Peijun","family":"Li","sequence":"first","affiliation":[{"name":"School of Integrated Circuits, Tsinghua University,Beijing,China,100084"}]},{"given":"Weiyi","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Tsinghua University,Beijing,China,100084"}]},{"given":"Zeyu","family":"Wan","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Tsinghua University,Beijing,China,100084"}]},{"given":"Chun","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Tsinghua University,Beijing,China,100084"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1109\/TRO.2017.2705103"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/TPAMI.2022.3151200"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/IROS.2012.6385773"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/IROS.2018.8593691"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/ACCESS.2020.2977684"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1109\/CCDC52312.2021.9602705"}],"event":{"name":"2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","start":{"date-parts":[[2023,10,27]]},"location":"Hefei, China","end":{"date-parts":[[2023,10,29]]}},"container-title":["2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10363774\/10363775\/10364289.pdf?arnumber=10364289","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T21:19:20Z","timestamp":1705094360000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10364289\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,27]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/icta60488.2023.10364289","relation":{},"subject":[],"published":{"date-parts":[[2023,10,27]]}}}