{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,2]],"date-time":"2025-11-02T15:57:27Z","timestamp":1762099047868,"version":"build-2065373602"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100014103","name":"China Key Research and Development Program","doi-asserted-by":"publisher","award":["2022YFB3603900"],"award-info":[{"award-number":["2022YFB3603900"]}],"id":[{"id":"10.13039\/100014103","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62034006,92264201,62104134,91964105"],"award-info":[{"award-number":["62034006,92264201,62104134,91964105"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100007129","name":"Natural Science Foundation of Shandong Province","doi-asserted-by":"publisher","award":["ZR2020JQ28,ZR2023QF054"],"award-info":[{"award-number":["ZR2020JQ28,ZR2023QF054"]}],"id":[{"id":"10.13039\/501100007129","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,27]]},"DOI":"10.1109\/icta60488.2023.10364316","type":"proceedings-article","created":{"date-parts":[[2023,12,28]],"date-time":"2023-12-28T19:21:00Z","timestamp":1703791260000},"page":"51-52","source":"Crossref","is-referenced-by-count":0,"title":["Simulation for the Feasibility of IGZO Channel in 3D Vertical FeFET Memory Based on TCAD"],"prefix":"10.1109","author":[{"given":"Zhichao","family":"Du","sequence":"first","affiliation":[{"name":"School of Information Science and Engineering, Shandong University,Qingdao,China"}]},{"given":"Chuanxue","family":"Sun","sequence":"additional","affiliation":[{"name":"School of Information Science and Engineering, Shandong University,Qingdao,China"}]},{"given":"Xiaoyu","family":"Dou","sequence":"additional","affiliation":[{"name":"School of Information Science and Engineering, Shandong University,Qingdao,China"}]},{"given":"Pengpeng","family":"Sang","sequence":"additional","affiliation":[{"name":"School of Information Science and Engineering, Shandong University,Qingdao,China"}]},{"given":"Xuepeng","family":"Zhan","sequence":"additional","affiliation":[{"name":"School of Information Science and Engineering, Shandong University,Qingdao,China"}]},{"given":"Chengji","family":"Jin","sequence":"additional","affiliation":[{"name":"Research Center for Intelligent Chips and Devices,Zhejiang Lab,Hangzhou,China"}]},{"given":"Jixuan","family":"Wu","sequence":"additional","affiliation":[{"name":"School of Information Science and Engineering, Shandong University,Qingdao,China"}]},{"given":"Jiezhi","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Information Science and Engineering, Shandong University,Qingdao,China"}]}],"member":"263","reference":[{"issue":"11","key":"ref1","doi-asserted-by":"crossref","DOI":"10.1063\/1.3636417","volume":"99","author":"M\u00fcller","year":"2011","journal-title":"Appl. Phys. Lett"},{"key":"ref2","first-page":"T158","author":"Florent","year":"2017","journal-title":"IEEE VLSI"},{"key":"ref3","first-page":"5.1","volume":"2","author":"Florent","year":"2018","journal-title":"IEEE IEDM"},{"key":"ref4","first-page":"T250","author":"Sunamura","year":"2013","journal-title":"IEEE VLSI"},{"issue":"SC","key":"ref5","doi-asserted-by":"crossref","first-page":"SC1013","DOI":"10.35848\/1347-4065\/ac3d0e","volume":"61","author":"Mo","year":"2022","journal-title":"JPN J APPL PHYS"},{"key":"ref6","first-page":"T220","author":"Jin","year":"2019","journal-title":"IEEE VLSI"},{"key":"ref7","first-page":"1","author":"Yang","year":"2020","journal-title":"IEEE ICEPT"},{"issue":"6","key":"ref8","first-page":"735","volume":"37","author":"Billah","year":"2016","journal-title":"IEEE EDL"}],"event":{"name":"2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","start":{"date-parts":[[2023,10,27]]},"location":"Hefei, China","end":{"date-parts":[[2023,10,29]]}},"container-title":["2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10363774\/10363775\/10364316.pdf?arnumber=10364316","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T20:50:12Z","timestamp":1705092612000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10364316\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,27]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/icta60488.2023.10364316","relation":{},"subject":[],"published":{"date-parts":[[2023,10,27]]}}}