{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T08:11:53Z","timestamp":1725783113107},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,27]],"date-time":"2023-10-27T00:00:00Z","timestamp":1698364800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,27]]},"DOI":"10.1109\/icta60488.2023.10364324","type":"proceedings-article","created":{"date-parts":[[2023,12,28]],"date-time":"2023-12-28T14:21:00Z","timestamp":1703773260000},"page":"146-147","source":"Crossref","is-referenced-by-count":2,"title":["A Non-Local Means Denoising Co-Processor with Data Reuse Scheme and Dual-Clock Domain for High Resolution Image Sensor"],"prefix":"10.1109","author":[{"given":"Zhiyue","family":"Gao","sequence":"first","affiliation":[{"name":"Southern University of Science and Technology"}]},{"given":"Fengwei","family":"An","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology"}]},{"given":"Lei","family":"Chen","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1186\/s42492-019-0016-7"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/CVPR.2005.38"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/TCSII.2022.3159261"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.3233\/apc200098"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/ICTA53157.2021.9661666"}],"event":{"name":"2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","start":{"date-parts":[[2023,10,27]]},"location":"Hefei, China","end":{"date-parts":[[2023,10,29]]}},"container-title":["2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10363774\/10363775\/10364324.pdf?arnumber=10364324","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T15:50:09Z","timestamp":1705074609000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10364324\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,27]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/icta60488.2023.10364324","relation":{},"subject":[],"published":{"date-parts":[[2023,10,27]]}}}