{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,6]],"date-time":"2026-03-06T18:48:08Z","timestamp":1772822888696,"version":"3.50.1"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,25]],"date-time":"2024-10-25T00:00:00Z","timestamp":1729814400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,25]],"date-time":"2024-10-25T00:00:00Z","timestamp":1729814400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,25]]},"DOI":"10.1109\/icta64028.2024.10860484","type":"proceedings-article","created":{"date-parts":[[2025,2,6]],"date-time":"2025-02-06T18:34:22Z","timestamp":1738866862000},"page":"152-153","source":"Crossref","is-referenced-by-count":2,"title":["An Ultra-Low Power Timing Based OOK Modulation CMOS Transmitter Applied in RF-Powered Temperature Sensor Node"],"prefix":"10.1109","author":[{"given":"Yongqiang","family":"Shi","sequence":"first","affiliation":[{"name":"Xi’an Jiaotong University,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shiquan","family":"Fan","sequence":"additional","affiliation":[{"name":"Xi’an Jiaotong University,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rui","family":"Zhang","sequence":"additional","affiliation":[{"name":"Xi’an Jiaotong University,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Li","family":"Geng","sequence":"additional","affiliation":[{"name":"Xi’an Jiaotong University,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2012.2215395"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2651817"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2325574"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/icicm48536.2019.8977180"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2017.8050415"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.891448"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.3390\/electronics12102181"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2020.3000994"}],"event":{"name":"2024 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","location":"Hangzhou, China","start":{"date-parts":[[2024,10,25]]},"end":{"date-parts":[[2024,10,27]]}},"container-title":["2024 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10860283\/10860285\/10860484.pdf?arnumber=10860484","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,2,7]],"date-time":"2025-02-07T06:51:51Z","timestamp":1738911111000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10860484\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,25]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/icta64028.2024.10860484","relation":{},"subject":[],"published":{"date-parts":[[2024,10,25]]}}}