{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T01:13:50Z","timestamp":1740100430516,"version":"3.37.3"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,10,20]],"date-time":"2021-10-20T00:00:00Z","timestamp":1634688000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,10,20]],"date-time":"2021-10-20T00:00:00Z","timestamp":1634688000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,10,20]],"date-time":"2021-10-20T00:00:00Z","timestamp":1634688000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100010418","name":"Institute of Information & communications Technology Planning & Evaluation (IITP)","doi-asserted-by":"publisher","award":["2020-0- 00839"],"award-info":[{"award-number":["2020-0- 00839"]}],"id":[{"id":"10.13039\/501100010418","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,10,20]]},"DOI":"10.1109\/ictc52510.2021.9621100","type":"proceedings-article","created":{"date-parts":[[2021,12,7]],"date-time":"2021-12-07T20:49:57Z","timestamp":1638910197000},"page":"65-68","source":"Crossref","is-referenced-by-count":0,"title":["Contactless Interconnect Circuit Design for Automotive CAN Communication"],"prefix":"10.1109","author":[{"given":"Ryu","family":"Seunghun","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kim","family":"Haerim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ahn","family":"Jangyong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ahn","family":"Seungyoung","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kim","family":"Jiseong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1007\/978-4-431-56594-9"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2004.834712"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/GHTCE.2012.6490130"},{"key":"ref5","first-page":"964","article-title":"RF capacitive coupling link for 3-D ICs","author":"choi","year":"2013","journal-title":"JKIEES"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICUFN.2015.7182505"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2010.2049355"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1364\/NFOEC.2010.JWA64"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2009.4977517"}],"event":{"name":"2021 International Conference on Information and Communication Technology Convergence (ICTC)","start":{"date-parts":[[2021,10,20]]},"location":"Jeju Island, Korea, Republic of","end":{"date-parts":[[2021,10,22]]}},"container-title":["2021 International Conference on Information and Communication Technology Convergence (ICTC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9620727\/9620211\/09621100.pdf?arnumber=9621100","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T16:53:43Z","timestamp":1652201623000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9621100\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,10,20]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/ictc52510.2021.9621100","relation":{},"subject":[],"published":{"date-parts":[[2021,10,20]]}}}