{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,28]],"date-time":"2026-02-28T10:40:50Z","timestamp":1772275250336,"version":"3.50.1"},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009]]},"DOI":"10.1109\/ictel.2009.5158665","type":"proceedings-article","created":{"date-parts":[[2009,7,7]],"date-time":"2009-07-07T18:18:41Z","timestamp":1246990721000},"page":"313-317","source":"Crossref","is-referenced-by-count":1,"title":["An integrated 0.35µm CMOS technology inductor for wideBand LNA application"],"prefix":"10.1109","author":[{"given":"M. Ben","family":"Amor","sequence":"first","affiliation":[]},{"given":"M.","family":"Loulou","sequence":"additional","affiliation":[]},{"given":"S.","family":"Quintanel","sequence":"additional","affiliation":[]},{"given":"D.","family":"Pasquet","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1971.1127658"},{"key":"ref3","article-title":"High-Q factor three-dimensional inductors","author":"piernas","year":"1942","journal-title":"IEEE Trans Microw Theory Tech"},{"key":"ref10","author":"ben amor","year":"2008","journal-title":"IEEE 4th European Conference on Circuits and Systems for Communications ECCSC'08"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2008.916941"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1080\/00207210701827863"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/22.668675"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/33.159877"},{"key":"ref7","article-title":"Microstrip Lines and Slotlines","author":"gupta","year":"1996"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/22.915439"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2008.916941"},{"key":"ref1","article-title":"Planar inductors with interleaved conductors for integrated power applications","author":"estibals","year":"2004","journal-title":"ISCAS 2004"}],"event":{"name":"2009 International Conference on Telecommunications","location":"Marrakech, Morroco","start":{"date-parts":[[2009,5,25]]},"end":{"date-parts":[[2009,5,27]]}},"container-title":["2009 International Conference on Telecommunications"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5089941\/5158601\/05158665.pdf?arnumber=5158665","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,17]],"date-time":"2017-03-17T17:22:56Z","timestamp":1489771376000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5158665\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/ictel.2009.5158665","relation":{},"subject":[],"published":{"date-parts":[[2009]]}}}