{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T21:56:13Z","timestamp":1725400573127},"reference-count":0,"publisher":"IEEE Comput. Soc","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/icvd.2003.1183102","type":"proceedings-article","created":{"date-parts":[[2005,4,12]],"date-time":"2005-04-12T14:25:04Z","timestamp":1113315904000},"page":"5-5","source":"Crossref","is-referenced-by-count":0,"title":["India-building the tall, thin VLSI engineer"],"prefix":"10.1109","author":[{"given":"R.","family":"Madhavan","sequence":"first","affiliation":[]}],"member":"263","event":{"name":"16th International Conference on VLSI Design. Concurrently with the 2nd International Conference on Embedded Systems Design","acronym":"ICVD-03","location":"New Delhi, India"},"container-title":["16th International Conference on VLSI Design, 2003. Proceedings."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8427\/26547\/01183102.pdf?arnumber=1183102","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,14]],"date-time":"2017-03-14T00:11:37Z","timestamp":1489450297000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1183102\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/icvd.2003.1183102","relation":{},"subject":[]}}