{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T08:42:31Z","timestamp":1725525751072},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,11]]},"DOI":"10.1109\/iecon.2015.7392704","type":"proceedings-article","created":{"date-parts":[[2016,3,8]],"date-time":"2016-03-08T17:52:31Z","timestamp":1457459551000},"page":"003875-003880","source":"Crossref","is-referenced-by-count":4,"title":["Comparative of modulation techniques for modular multilevel converter"],"prefix":"10.1109","author":[{"given":"M.","family":"Moranchel","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"I.","family":"Sanz","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"E. J.","family":"Bueno","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"F. J.","family":"Rodriguez","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/41.982262"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2327641"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2006.881989"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2010.5617971"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2278338"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/PTC.2003.1304403"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISIE.2013.6563674"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/AMS.2010.125"},{"key":"ref5","first-page":"1","article-title":"Prospects and challenges of future HVDC SuperGrids with modular multilevel converters","author":"ahmed","year":"2011","journal-title":"Proc 14th EPE Conf Appl"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2007.911865"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/28.913731"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TEC.2006.889624"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2008.2008441"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2003.818827"}],"event":{"name":"IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society","start":{"date-parts":[[2015,11,9]]},"location":"Yokohama","end":{"date-parts":[[2015,11,12]]}},"container-title":["IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7378180\/7392066\/07392704.pdf?arnumber=7392704","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T19:05:25Z","timestamp":1490382325000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7392704\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,11]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/iecon.2015.7392704","relation":{},"subject":[],"published":{"date-parts":[[2015,11]]}}}