{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T13:21:34Z","timestamp":1773840094503,"version":"3.50.1"},"reference-count":21,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,10]]},"DOI":"10.1109\/iecon.2017.8216274","type":"proceedings-article","created":{"date-parts":[[2017,12,21]],"date-time":"2017-12-21T22:02:40Z","timestamp":1513893760000},"page":"1616-1621","source":"Crossref","is-referenced-by-count":9,"title":["Thermal network parameters identifying during the cooling procedure of IGBT module"],"prefix":"10.1109","author":[{"given":"Jun","family":"Zhang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiong","family":"Du","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Pengju","family":"Sun","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Heng-Ming","family":"Tai","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TEC.2015.2422792"},{"key":"ref11","year":"2010","journal-title":"Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-to-Case of Semiconductor Devices with Heat Flow Through a Single Path"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2008.09.002"},{"key":"ref13","first-page":"1","article-title":"Prognostic system for power modules in converter systems using structure function","volume":"pp","author":"aliyu","year":"2017","journal-title":"IEEE Trans Power Electron"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/63.728349"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2015.2497665"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2011.2168556"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2011.2160988"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2539208"},{"key":"ref19","first-page":"241","article-title":"Thermal impedance monitoring during power cycling tests","author":"hensler","year":"2011","journal-title":"Proc PCIM Europe"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2011.2178433"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2016.07.141"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2318991"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2010.2049377"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2509506"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-11125-9"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2373390"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2654599"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2013.6647210"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2418711"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1049\/cp:20080533"}],"event":{"name":"IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society","location":"Beijing","start":{"date-parts":[[2017,10,29]]},"end":{"date-parts":[[2017,11,1]]}},"container-title":["IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8168197\/8216002\/08216274.pdf?arnumber=8216274","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,1,29]],"date-time":"2018-01-29T22:19:10Z","timestamp":1517264350000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8216274\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,10]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/iecon.2017.8216274","relation":{},"subject":[],"published":{"date-parts":[[2017,10]]}}}