{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,31]],"date-time":"2025-12-31T12:15:54Z","timestamp":1767183354095},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,10]]},"DOI":"10.1109\/iecon.2017.8217388","type":"proceedings-article","created":{"date-parts":[[2017,12,21]],"date-time":"2017-12-21T17:02:40Z","timestamp":1513875760000},"page":"7917-7922","source":"Crossref","is-referenced-by-count":7,"title":["A method of active junction temperature control for IGBT"],"prefix":"10.1109","author":[{"given":"Bo","family":"Wang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Luowei","family":"Zhou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yi","family":"Zhang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Pengju","family":"Sun","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2016.7855131"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2013.6646698"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2010.2087393"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2010.2087394"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2013.2240644"},{"journal-title":"POWER ELECTRONICS Converters Applications and Design","year":"2003","author":"ned mohan","key":"ref15"},{"journal-title":"Fuji IGBT Simulator (Ver 6 0 5) [EB\/OL]","year":"0","key":"ref16"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/IAS.1991.178059"},{"key":"ref4","article-title":"IGBT- Modules: Design for Reliability[C]","author":"lutz","year":"2009","journal-title":"IEEE Proceeding of 13th European Conference on Power Electronics and Applications(EPE)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s40565-015-0172-5"},{"key":"ref6","article-title":"Model for Power Cycling lifetime of IGBT Modules - various factors influencing lifetime[C]","author":"bayerer","year":"2008","journal-title":"Proceedings of the 5th International Conference on Integrated Power Electronic Systems"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(02)00042-2"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1049\/iet-pel.2014.0962"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/EPE.2014.6910822"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TEC.2006.889614"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1049\/iet-rpg.2008.0060"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.2015.7392925"}],"event":{"name":"IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society","start":{"date-parts":[[2017,10,29]]},"location":"Beijing","end":{"date-parts":[[2017,11,1]]}},"container-title":["IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8168197\/8216002\/08217388.pdf?arnumber=8217388","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,1,26]],"date-time":"2018-01-26T05:54:13Z","timestamp":1516946053000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8217388\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,10]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/iecon.2017.8217388","relation":{},"subject":[],"published":{"date-parts":[[2017,10]]}}}