{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,16]],"date-time":"2025-06-16T14:11:08Z","timestamp":1750083068818,"version":"3.28.0"},"reference-count":22,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,10]]},"DOI":"10.1109\/iecon.2018.8591192","type":"proceedings-article","created":{"date-parts":[[2019,1,18]],"date-time":"2019-01-18T22:30:15Z","timestamp":1547850615000},"page":"4920-4925","source":"Crossref","is-referenced-by-count":4,"title":["Validated Thermal Air Management Simulations of Data Centers Using Remote Graphics Processing Units"],"prefix":"10.1109","author":[{"given":"Johannes","family":"Sjolund","sequence":"first","affiliation":[]},{"given":"Mattias","family":"Vesterlund","sequence":"additional","affiliation":[]},{"given":"Nicolas","family":"Delbosc","sequence":"additional","affiliation":[]},{"given":"Amirul","family":"Khan","sequence":"additional","affiliation":[]},{"given":"Jon","family":"Summers","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"crossref","first-page":"110","DOI":"10.1115\/1.4039025","article-title":"Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles","volume":"140","author":"athavale","year":"2018","journal-title":"J Electron Packag"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.apenergy.2018.01.031"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1115\/1.4039028"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.3390\/en11030644"},{"key":"ref14","doi-asserted-by":"crossref","first-page":"126139","DOI":"10.1016\/j.jpdc.2017.04.015","article-title":"Rate-based thermal, power, and co-location aware resource management for heterogeneous data centers","volume":"112","author":"oxley","year":"2018","journal-title":"J Parallel Distrib Comput"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.suscom.2017.12.005"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1146\/annurev.fluid.30.1.329"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1108\/HFF-10-2016-0431"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.camwa.2013.10.002"},{"journal-title":"Real-Time Simulation of Indoor Air Flow using the Lattice Boltzmann Method on Graphics Processing Unit","year":"2015","author":"delbosc","key":"ref19"},{"key":"ref4","article-title":"9.9 (2011) Thermal guidelines for data processing environmentsexpanded data center classes and usage guidance","volume":"9","author":"ashrae","year":"2011","journal-title":"Whitepaper Prep by ASHRAE Tech Comm"},{"key":"ref3","article-title":"Data Center Networking Equipment - Issues and Best Practices","author":"ashrae","year":"2015","journal-title":"Whitepaper Prep by ASHRAE Tech Comm"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.3130\/jaabe.7.387"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TSUSC.2018.2809574"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.apenergy.2016.03.076"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1115\/1.4000703"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.rser.2016.09.050"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.comcom.2014.02.008"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2806889"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevE.56.6811"},{"journal-title":"Real-time Thermal Flow Predictions for Data Centers","year":"2018","author":"sjolund","key":"ref22"},{"key":"ref21","doi-asserted-by":"crossref","DOI":"10.1007\/978-3-540-27982-2","author":"sukop","year":"2006","journal-title":"Lattice Boltzmann Modeling An Introduction for Geoscientists and Engineers"}],"event":{"name":"IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society","start":{"date-parts":[[2018,10,21]]},"location":"D.C., DC, USA","end":{"date-parts":[[2018,10,23]]}},"container-title":["IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8560606\/8591058\/08591192.pdf?arnumber=8591192","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,8,24]],"date-time":"2020-08-24T06:09:30Z","timestamp":1598249370000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8591192\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,10]]},"references-count":22,"URL":"https:\/\/doi.org\/10.1109\/iecon.2018.8591192","relation":{},"subject":[],"published":{"date-parts":[[2018,10]]}}}