{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T04:23:07Z","timestamp":1730262187577,"version":"3.28.0"},"reference-count":51,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/iecon.2019.8927816","type":"proceedings-article","created":{"date-parts":[[2019,12,27]],"date-time":"2019-12-27T21:00:17Z","timestamp":1577480417000},"page":"7128-7134","source":"Crossref","is-referenced-by-count":7,"title":["Overview and new trends in technology bricks for reliability enhancement in future wide band gap power converters for More Electrical Aircraft (MEA) and More Electrical Propulsion (MEP) systems"],"prefix":"10.1109","author":[{"given":"Bertrand","family":"Revol","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Stephane","family":"Azzopardi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Toni","family":"Youssef","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jean Sylvio Ngoua","family":"Teu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Cyrille","family":"Gautier","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rabih","family":"Khazaka","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sara","family":"Roggia","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Trapping and Reliability investigations in GaN-based HEMTs","year":"2016","author":"benvegn\u00f9","key":"ref39"},{"journal-title":"2016 Epitaxy and devices applications and technologies trends 2016 report","year":"2016","author":"gan","key":"ref38"},{"journal-title":"Silicon Carbide Power Devices World Scientific","year":"2005","author":"baliga","key":"ref33"},{"key":"ref32","article-title":"SiC market and industry update, presented at the Int","author":"roussel","year":"2011","journal-title":"Int SiC Power Electron Appl Workshop"},{"journal-title":"IPDiA 3D Silicon Capacitors Product catalogue","year":"0","key":"ref31"},{"key":"ref30","article-title":"Film Capacitors for High Temperature, High Voltage and High Current","author":"caliari","year":"0","journal-title":"Proceedings of CARTS International 2013"},{"journal-title":"SiC & GaN - Technology & market knowledge update Yole Development","year":"2015","author":"avron","key":"ref37"},{"key":"ref36","article-title":"Etude de la robustesse de transistors JFET à base de SiC vis-à-vis de stress électriques","author":"moumen","year":"2012","journal-title":"These ENS Cachan 28 mars"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2013.07.072"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2008.926672"},{"journal-title":"Cornell Dubilier Application Guide for Aluminum Electrolytic Capacitors","year":"0","key":"ref28"},{"year":"0","key":"ref27"},{"journal-title":"A look at high (200 °C) temperature capacitor technology","year":"2014","author":"slovick","key":"ref29"},{"key":"ref2","article-title":"Future Electrification beyond the More Electric Aircraft","author":"huang","year":"2018","journal-title":"IAS Webinar Series"},{"journal-title":"Perspectives and activities on hybrid \/ electric propulsion MEA","year":"2019","author":"garnier","key":"ref1"},{"key":"ref20","first-page":"1","article-title":"An Improved Parasitic Capacitance Cancellation Method for Planar Differential Mode Inductor in EMI Filters","author":"tan","year":"0","journal-title":"2012 7th International Conference on Integrated Power Electronics Systems (CIPS)"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2471090"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2010.2045327"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2382175"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2016.7855352"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/IWIPP.2015.7295976"},{"journal-title":"Capacitors in Power Electronics Applications - Reliability and Circuit Design IECON","year":"2016","author":"wang","key":"ref25"},{"journal-title":"Procédé de communication dans un dispositif électronique de commande rapprochée d'un système électronique","year":"0","author":"weckbrodt","key":"ref50"},{"key":"ref51","article-title":"Communication using the Isolated Power Supply of Gate Drivers for SiC Semiconductors Monitoring applications","author":"weckbrodt","year":"0","journal-title":"PCIM 2019 Nuremberg"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2674599"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ICD.2016.7547696"},{"key":"ref40","doi-asserted-by":"crossref","first-page":"815","DOI":"10.1109\/JESTPE.2016.2557316","article-title":"Paralleled operation of high-voltage cascode GaN HEMTs","volume":"4","author":"hemts","year":"2016","journal-title":"IEEE Journal of Emerging and Selected Topics in Power Electronics"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2009.2012404"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/EPE.2013.6634697"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2283263"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2016.7467971"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2013.2237772"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ICIEA.2013.6566412"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ICIEA.2011.5975848"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2010.2091398"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MIE.2012.2221355"},{"key":"ref3","article-title":"trends for electrical architectures","author":"roques","year":"2017","journal-title":"More Electric Aircraft conference MEA 2017"},{"key":"ref6","article-title":"Development of a 12kW isolated and bidirectional DC-DC Converter dedicated to the More Electrical Aircraft: The Buck Boost Converter Unit (BBCU)","author":"asfaux","year":"2016","journal-title":"PCIM"},{"key":"ref5","article-title":"Integrated Modular Power Electronics: Achievements and Challenges","author":"bensalah","year":"2015","journal-title":"IMPEC MEA2015 Toulouse"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TTE.2017.2686327"},{"journal-title":"Bidirectional DC-DC converter in dual DC networks Michel Jamot Airbus Helicopters MEA","year":"2017","key":"ref7"},{"journal-title":"Procédé de fabrication d'un module électronique de puissance","year":"0","author":"khazaka","key":"ref49"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2010.2046005"},{"key":"ref46","first-page":"1933","volume":"53","author":"skuriat","year":"2013","journal-title":"Degradation of thermal interface materials for high-temperature power electronics applications Microelectronics Reliability"},{"journal-title":"Fundamentals of Microsystems Packaging","year":"2001","author":"tummala","key":"ref45"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2019.00-21"},{"journal-title":"Procédé de fabrication d'un module électronique de puissance","year":"0","author":"pending","key":"ref47"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1116\/1.4799504"},{"key":"ref41","first-page":"3049","article-title":"Paralleling GaN E-HEMTs in 10kW100kW systems","author":"lucas","year":"0","journal-title":"IEEE Applied Power Electronics Conference and Exposition (APEC)"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2015.06.085"},{"key":"ref43","article-title":"A multiphysics cosimulation for a wide band gap power module fatigue-related performance assessment","author":"boulbene","year":"0","journal-title":"NAFEMS Americas Conference The International Association for the Engineering Modeling Analysis and Simulation Community"}],"event":{"name":"IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society","start":{"date-parts":[[2019,10,14]]},"location":"Lisbon, Portugal","end":{"date-parts":[[2019,10,17]]}},"container-title":["IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8897531\/8926608\/08927816.pdf?arnumber=8927816","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,27]],"date-time":"2022-01-27T23:06:55Z","timestamp":1643324815000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8927816\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":51,"URL":"https:\/\/doi.org\/10.1109\/iecon.2019.8927816","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}