{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,12]],"date-time":"2026-06-12T16:58:03Z","timestamp":1781283483731,"version":"3.54.1"},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,10,18]],"date-time":"2020-10-18T00:00:00Z","timestamp":1602979200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,10,18]],"date-time":"2020-10-18T00:00:00Z","timestamp":1602979200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,10,18]],"date-time":"2020-10-18T00:00:00Z","timestamp":1602979200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,10,18]]},"DOI":"10.1109\/iecon43393.2020.9255166","type":"proceedings-article","created":{"date-parts":[[2020,11,18]],"date-time":"2020-11-18T21:55:32Z","timestamp":1605736532000},"page":"3011-3016","source":"Crossref","is-referenced-by-count":17,"title":["Study on the failure of IGBT bonding wire based on temperature gradient"],"prefix":"10.1109","author":[{"given":"Chunming","family":"Tu","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Haoliang","family":"Xu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Biao","family":"Xiao","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Liu","family":"Long","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ming","family":"Chai","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref4","first-page":"165","article-title":"Characteristic analysis of IGBT module bonding wire breakout based on wavelet singular entropy theory","volume":"28","author":"shen","year":"2013","journal-title":"Journal of Electrical Technology"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2011.2124436"},{"key":"ref10","first-page":"22","article-title":"Ultrasonic wire bonding technology in high power IGBT module packaging","volume":"2011","author":"qin","year":"0","journal-title":"High Power Converter Technology"},{"key":"ref6","first-page":"10","article-title":"Research on failure of IGBT module bonding wire","volume":"14","author":"zhou","year":"2016","journal-title":"Journal of Power Supply"},{"key":"ref11","first-page":"293","article-title":"Development of ultrasonic welding for IGBT module structure","author":"nishimura","year":"2010","journal-title":"International Symposium on Power Semiconductor Devices & IC's (ISPSD) 2010"},{"key":"ref5","first-page":"136","article-title":"Thermal reliability of power insulated gate bipolar transistor modules","author":"wu","year":"1996","journal-title":"Semiconductor ddeueu Measurement and Management Symposium"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2010.5702634"},{"key":"ref8","first-page":"252","article-title":"Study on the health state of IGBT solder layer based on multi physical field of electric-thermal-mechanical","volume":"30","author":"chen","year":"2015","journal-title":"Journal of Electrical Technology"},{"key":"ref7","first-page":"55","article-title":"Research on temperature characteristics of IGBT power module under bonding wire fault","volume":"49","author":"yu","year":"2015","journal-title":"Power electronic technology"},{"key":"ref2","first-page":"34","article-title":"Status and development of power electronic devices and their applications","volume":"34","author":"qian","year":"2014","journal-title":"Chinese Journal of Electrical Engineering"},{"key":"ref9","first-page":"17","article-title":"IGBT reliability and on-line evaluation at high temperature","volume":"29","author":"tang","year":"2014","journal-title":"Journal of Electrical Technology"},{"key":"ref1","first-page":"5162","article-title":"Interconnection and networking technology of power electronic equipment in distribution network","volume":"34","author":"he","year":"2014","journal-title":"Chinese Journal of Electrical Engineering"}],"event":{"name":"IECON 2020 - 46th Annual Conference of the IEEE Industrial Electronics Society","location":"Singapore, Singapore","start":{"date-parts":[[2020,10,18]]},"end":{"date-parts":[[2020,10,21]]}},"container-title":["IECON 2020 The 46th Annual Conference of the IEEE Industrial Electronics Society"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9254213\/9254215\/09255166.pdf?arnumber=9255166","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,28]],"date-time":"2022-06-28T21:55:58Z","timestamp":1656453358000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9255166\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,10,18]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/iecon43393.2020.9255166","relation":{},"subject":[],"published":{"date-parts":[[2020,10,18]]}}}