{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T04:21:18Z","timestamp":1730262078275,"version":"3.28.0"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,10,13]],"date-time":"2021-10-13T00:00:00Z","timestamp":1634083200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,10,13]],"date-time":"2021-10-13T00:00:00Z","timestamp":1634083200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,10,13]],"date-time":"2021-10-13T00:00:00Z","timestamp":1634083200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,10,13]]},"DOI":"10.1109\/iecon48115.2021.9589509","type":"proceedings-article","created":{"date-parts":[[2021,11,10]],"date-time":"2021-11-10T18:47:51Z","timestamp":1636570071000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Substrate Solder Crack Evaluation and Modelling of Power Module under Passive Cycling"],"prefix":"10.1109","author":[{"given":"Zhongxu","family":"Wang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yangang","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lee","family":"Coulbeck","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiang","family":"Li","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Gong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2008.07.019"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/HDP.2007.4283558"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2012.09.014"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijsolstr.2016.12.003"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.tafmec.2015.12.011"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(99)00061-X"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2018.07.002"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"243","DOI":"10.1016\/j.microrel.2016.07.098","article-title":"Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling","volume":"65","author":"benabou","year":"2016","journal-title":"Microelectronics Reliability"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2016.10.002"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.csite.2019.100492"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2016.07.020"}],"event":{"name":"IECON 2021 - 47th Annual Conference of the IEEE Industrial Electronics Society","start":{"date-parts":[[2021,10,13]]},"location":"Toronto, ON, Canada","end":{"date-parts":[[2021,10,16]]}},"container-title":["IECON 2021 \u2013 47th Annual Conference of the IEEE Industrial Electronics Society"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9588332\/9589036\/09589509.pdf?arnumber=9589509","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T12:50:05Z","timestamp":1652187005000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9589509\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,10,13]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/iecon48115.2021.9589509","relation":{},"subject":[],"published":{"date-parts":[[2021,10,13]]}}}