{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,6]],"date-time":"2024-10-06T01:10:30Z","timestamp":1728177030671},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,10,13]],"date-time":"2021-10-13T00:00:00Z","timestamp":1634083200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,10,13]],"date-time":"2021-10-13T00:00:00Z","timestamp":1634083200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,10,13]],"date-time":"2021-10-13T00:00:00Z","timestamp":1634083200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,10,13]]},"DOI":"10.1109\/iecon48115.2021.9589724","type":"proceedings-article","created":{"date-parts":[[2021,11,10]],"date-time":"2021-11-10T23:47:51Z","timestamp":1636588071000},"page":"1-5","source":"Crossref","is-referenced-by-count":5,"title":["Enhanced Cooling of Multilayer PCB Motor Windings Using Thermal Vias"],"prefix":"10.1109","author":[{"given":"Andreas","family":"Bauer","sequence":"first","affiliation":[]},{"given":"Benjamin H.","family":"Zacher","sequence":"additional","affiliation":[]},{"given":"Christian","family":"Schumann","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/APEC.2008.4522723"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/FLEPS.2019.8792308"},{"year":"2018","journal-title":"Application Report SLMA002H–November 1997","article-title":"PowerPAD™ Thermally Enhanced Package","key":"ref10"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1109\/IECON.2013.6699576"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/TPEL.2019.2915029"},{"year":"2009","journal-title":"Standard for Determining Current-Carrying Capacity in Printed Board Design","key":"ref5"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1109\/STHERM.1996.545107"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1109\/ACCESS.2019.2952893"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/IECON.2014.7048535"},{"year":"2013","journal-title":"Application Report SNVA419C–April 2010","article-title":"AN-2020 Thermal Design By Insight, Not Hind-sight","key":"ref9"},{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1049\/iet-epa.2020.0141"}],"event":{"name":"IECON 2021 - 47th Annual Conference of the IEEE Industrial Electronics Society","start":{"date-parts":[[2021,10,13]]},"location":"Toronto, ON, Canada","end":{"date-parts":[[2021,10,16]]}},"container-title":["IECON 2021 \u2013 47th Annual Conference of the IEEE Industrial Electronics Society"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9588332\/9589036\/09589724.pdf?arnumber=9589724","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T16:50:11Z","timestamp":1652201411000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9589724\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,10,13]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/iecon48115.2021.9589724","relation":{},"subject":[],"published":{"date-parts":[[2021,10,13]]}}}