{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,12]],"date-time":"2026-06-12T16:57:37Z","timestamp":1781283457136,"version":"3.54.1"},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,10,13]],"date-time":"2021-10-13T00:00:00Z","timestamp":1634083200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,10,13]],"date-time":"2021-10-13T00:00:00Z","timestamp":1634083200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,10,13]],"date-time":"2021-10-13T00:00:00Z","timestamp":1634083200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,10,13]]},"DOI":"10.1109\/iecon48115.2021.9589885","type":"proceedings-article","created":{"date-parts":[[2021,11,10]],"date-time":"2021-11-10T23:47:51Z","timestamp":1636588071000},"page":"1-6","source":"Crossref","is-referenced-by-count":8,"title":["Benefits of Finer Semiconductor Device Granularity on Power Converter Thermal Stress and MTTF"],"prefix":"10.1109","author":[{"given":"Roya","family":"Rafiezadeh","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sergio","family":"Busquets-Monge","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Salvador","family":"Alepuz","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","article-title":"An intelligent electronic fuse (iFuse) to enable short-circuit fault-tolerant operation of power electronic converters","author":"filba-martinez","year":"2020","journal-title":"IEEE TechRxiv"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2211315"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3087446"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2010.2098376"},{"key":"ref14","author":"mohan","year":"1995","journal-title":"POWER ELECTRONICS Converters Applications and Design"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2005.863905"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2005.847586"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICPE.2015.7168091"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2665697"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2816002"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.2018.8591675"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2229472"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2352341"},{"key":"ref9","volume":"2","author":"maerz","year":"2000","journal-title":"Thermal modeling of power-electronic systems"}],"event":{"name":"IECON 2021 - 47th Annual Conference of the IEEE Industrial Electronics Society","location":"Toronto, ON, Canada","start":{"date-parts":[[2021,10,13]]},"end":{"date-parts":[[2021,10,16]]}},"container-title":["IECON 2021 \u2013 47th Annual Conference of the IEEE Industrial Electronics Society"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9588332\/9589036\/09589885.pdf?arnumber=9589885","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T16:50:08Z","timestamp":1652201408000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9589885\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,10,13]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/iecon48115.2021.9589885","relation":{},"subject":[],"published":{"date-parts":[[2021,10,13]]}}}