{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,25]],"date-time":"2026-04-25T15:06:35Z","timestamp":1777129595466,"version":"3.51.4"},"reference-count":43,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,11,3]],"date-time":"2024-11-03T00:00:00Z","timestamp":1730592000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,11,3]],"date-time":"2024-11-03T00:00:00Z","timestamp":1730592000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000015","name":"U.S. Department of Energy","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000015","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,11,3]]},"DOI":"10.1109\/iecon55916.2024.10905597","type":"proceedings-article","created":{"date-parts":[[2025,3,10]],"date-time":"2025-03-10T17:32:07Z","timestamp":1741627927000},"page":"1-7","source":"Crossref","is-referenced-by-count":1,"title":["Electrical Design and Evaluation for a 10 kV SiC Power Module-Based Submodule of a Modular Multilevel Converter"],"prefix":"10.1109","author":[{"given":"Qichen","family":"Yang","sequence":"first","affiliation":[{"name":"Florida State University,Center for Advanced Power Systems,Tallahassee,FL,USA,32310"}]},{"given":"Sihun","family":"Song","sequence":"additional","affiliation":[{"name":"Florida State University,Center for Advanced Power Systems,Tallahassee,FL,USA,32310"}]},{"given":"Nash","family":"Bonaventura","sequence":"additional","affiliation":[{"name":"Florida State University,Center for Advanced Power Systems,Tallahassee,FL,USA,32310"}]},{"given":"Isabel","family":"Barnola","sequence":"additional","affiliation":[{"name":"Florida State University,Center for Advanced Power Systems,Tallahassee,FL,USA,32310"}]},{"given":"Robin","family":"Ramin","sequence":"additional","affiliation":[{"name":"Florida State University,Center for Advanced Power Systems,Tallahassee,FL,USA,32310"}]},{"given":"Christoph","family":"Diendorfer","sequence":"additional","affiliation":[{"name":"Florida State University,Center for Advanced Power Systems,Tallahassee,FL,USA,32310"}]},{"given":"John","family":"Hauer","sequence":"additional","affiliation":[{"name":"Florida State University,Center for Advanced Power Systems,Tallahassee,FL,USA,32310"}]},{"given":"Matthew","family":"Bosworth","sequence":"additional","affiliation":[{"name":"Florida State University,Center for Advanced Power Systems,Tallahassee,FL,USA,32310"}]},{"given":"Karl","family":"Schodar","sequence":"additional","affiliation":[{"name":"Florida State University,Center for Advanced Power Systems,Tallahassee,FL,USA,32310"}]},{"given":"Michael","family":"Steurer","sequence":"additional","affiliation":[{"name":"Florida State University,Center for Advanced Power Systems,Tallahassee,FL,USA,32310"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/PTC.2003.1304403"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2310127"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2309937"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ESTS56571.2023.10220476"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/b978-0-12-811407-0.00052-0"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.24295\/CPSSTPEA.2018.00028"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2018.2870084"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2020.2995386"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2723601"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2023.3256389"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3137839"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/pesc.2005.1581951"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ESTS56571.2023.10220493"},{"key":"ref14","doi-asserted-by":"crossref","DOI":"10.1109\/IECON55916.2024.10905281","article-title":"Advanced Hardware-in-the-Loop Testbed for Development of Grid Connected Medium Voltage Modular Multilevel Converter","volume-title":"Proc. IEEE IECON","author":"Song"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/APEC43599.2022.9773466"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE55643.2024.10861550"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2728723"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JESTIE.2020.3039108"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.2980564"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/OJIA.2024.3353309"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/WiPDA49284.2021.9645106"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2020.3008344"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2020.3000131"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2019.2943742"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2021.3107343"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2018.8557489"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3108048"},{"key":"ref28","first-page":"01","article-title":"Insulation Design and Analysis of a Medium Voltage Planar PCB-based Power Bus Considering Interconnects and Ancillary Circuit Integration","volume-title":"Proc. IEEE EPE","author":"Stewart"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/APEC39645.2020.9124543"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2021.3131602"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/63.988833"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2691668"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/WiPDA56483.2022.9955261"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2018.8558380"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2019.2922332"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2020.2999403"},{"key":"ref37","article-title":"Switched Capacitor MMC SM Voltage Balancing with Reduced Number of Voltage Sensors","volume-title":"Proc. IEEE ECCE","author":"Gonzatti"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2201433"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2019.2923582"},{"key":"ref40","article-title":"Cooling aggregates with axial fan"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/TAES.2023.3263157"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TASC.2019.2895153"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2977138"}],"event":{"name":"IECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society","location":"Chicago, IL, USA","start":{"date-parts":[[2024,11,3]]},"end":{"date-parts":[[2024,11,6]]}},"container-title":["IECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10904979\/10905066\/10905597.pdf?arnumber=10905597","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,11]],"date-time":"2025-03-11T05:21:32Z","timestamp":1741670492000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10905597\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,11,3]]},"references-count":43,"URL":"https:\/\/doi.org\/10.1109\/iecon55916.2024.10905597","relation":{},"subject":[],"published":{"date-parts":[[2024,11,3]]}}}