{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,8]],"date-time":"2025-12-08T22:03:27Z","timestamp":1765231407506,"version":"3.38.0"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,11,3]],"date-time":"2024-11-03T00:00:00Z","timestamp":1730592000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,11,3]],"date-time":"2024-11-03T00:00:00Z","timestamp":1730592000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,11,3]]},"DOI":"10.1109\/iecon55916.2024.10905822","type":"proceedings-article","created":{"date-parts":[[2025,3,10]],"date-time":"2025-03-10T17:32:07Z","timestamp":1741627927000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Virtual Admittance Based Modeling and Stability Analysis of Grid-Forming Inverter under Clark Transformation"],"prefix":"10.1109","author":[{"given":"Boyuan","family":"Cui","sequence":"first","affiliation":[{"name":"The Chinese University of Hong Kong,Department of Electronic Engineering,Hong Kong,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Liang","family":"Huang","sequence":"additional","affiliation":[{"name":"Aalborg University,AAU Energy,Aalborg,Denmark"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chao","family":"Gao","sequence":"additional","affiliation":[{"name":"The Chinese University of Hong Kong,Department of Electronic Engineering,Hong Kong,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Poh Chiang","family":"Loh","sequence":"additional","affiliation":[{"name":"The Chinese University of Hong Kong,Department of Electronic Engineering,Hong Kong,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2019.2959271"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TSG.2017.2749259"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2019.2946310"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/OJIA.2021.3074028"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/PTC.2013.6652456"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2010.2048839"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijepes.2013.07.009"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPWRS.2009.2032231"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCNS.2019.2921347"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE47101.2021.9595056"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2019.2942491"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2022.3199906"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/eGRID52793.2021.9662150"}],"event":{"name":"IECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society","start":{"date-parts":[[2024,11,3]]},"location":"Chicago, IL, USA","end":{"date-parts":[[2024,11,6]]}},"container-title":["IECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10904979\/10905066\/10905822.pdf?arnumber=10905822","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,11]],"date-time":"2025-03-11T05:12:31Z","timestamp":1741669951000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10905822\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,11,3]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/iecon55916.2024.10905822","relation":{},"subject":[],"published":{"date-parts":[[2024,11,3]]}}}