{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,20]],"date-time":"2025-09-20T18:36:49Z","timestamp":1758393409140,"version":"3.38.0"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,11,3]],"date-time":"2024-11-03T00:00:00Z","timestamp":1730592000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,11,3]],"date-time":"2024-11-03T00:00:00Z","timestamp":1730592000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,11,3]]},"DOI":"10.1109\/iecon55916.2024.10905884","type":"proceedings-article","created":{"date-parts":[[2025,3,10]],"date-time":"2025-03-10T17:32:07Z","timestamp":1741627927000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Analysis of Ground Fault Protection in Low Voltage Distribution TN-S System"],"prefix":"10.1109","author":[{"given":"Wei","family":"Li","sequence":"first","affiliation":[{"name":"CITIC General Institute of Architectural Design and Research Co., Ltd,Wuhan,China"}]},{"given":"Guangxi","family":"Li","sequence":"additional","affiliation":[{"name":"CITIC General Institute of Architectural Design and Research Co., Ltd,Wuhan,China"}]},{"given":"Weihao","family":"Tang","sequence":"additional","affiliation":[{"name":"CITIC General Institute of Architectural Design and Research Co., Ltd,Wuhan,China"}]},{"given":"Weiqi","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering and Automation,Harbin,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2015.2464308"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2015.2443093"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2017.2746558"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2023.3258934"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/iSPEC50848.2020.9351016"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/CIYCEE49808.2020.9332535"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2016.2601563"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPWRD.2022.3174878"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/EEEIC.2018.8493856"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ieeestd.2007.4384312"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/REPE48501.2019.9025151"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ieeestd.2025.10811802"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/APET59977.2023.10489135"}],"event":{"name":"IECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society","start":{"date-parts":[[2024,11,3]]},"location":"Chicago, IL, USA","end":{"date-parts":[[2024,11,6]]}},"container-title":["IECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10904979\/10905066\/10905884.pdf?arnumber=10905884","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,11]],"date-time":"2025-03-11T05:12:48Z","timestamp":1741669968000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10905884\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,11,3]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/iecon55916.2024.10905884","relation":{},"subject":[],"published":{"date-parts":[[2024,11,3]]}}}