{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T20:57:01Z","timestamp":1729630621666,"version":"3.28.0"},"reference-count":33,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,12]]},"DOI":"10.1109\/igcc.2015.7393727","type":"proceedings-article","created":{"date-parts":[[2016,1,28]],"date-time":"2016-01-28T16:41:09Z","timestamp":1453999269000},"page":"1-6","source":"Crossref","is-referenced-by-count":3,"title":["Thermal-aware power budgeting for dark silicon chips"],"prefix":"10.1109","author":[{"given":"Santiago","family":"Pagani","sequence":"first","affiliation":[]},{"given":"Jian-Jia","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Muhammad","family":"Shafique","sequence":"additional","affiliation":[]},{"given":"Jorg","family":"Henkel","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2293422"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1145\/1120725.1120753"},{"key":"ref31","first-page":"1434","article-title":"3-D Thermal-ADI: a linear-time chip level transient thermal simulator","volume":"21","author":"wang","year":"2002","journal-title":"TCAD"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1145\/2442087.2442099"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/2744769.2744916"},{"key":"ref11","first-page":"361","article-title":"Logi-thermal simulation of digital CMOS ICs with emphasis on dynamic power dissipation","author":"klab","year":"2009","journal-title":"MIXDES"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593094"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/2380445.2380487"},{"journal-title":"Automatic Control Systems","year":"2002","author":"kuo","key":"ref14"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/1629911.1629926"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.282"},{"key":"ref17","first-page":"469","article-title":"McPAT: An integrated power, area, and timing modeling framework for multicore and manycore architectures","author":"li","year":"2009","journal-title":"Micro"},{"journal-title":"Differential Equations An Operational Approach","year":"2011","author":"moya-cessa","key":"ref18"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488949"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593229"},{"journal-title":"Numerical Optimization Theoretical and Practical Aspects","year":"2006","author":"bonnans","key":"ref4"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2012.12"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593117"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2039370.2039401"},{"key":"ref29","doi-asserted-by":"crossref","first-page":"387","DOI":"10.7873\/DATE.2015.0900","article-title":"Variability-Aware Dark Silicon Management in On-Chip Many-Core Systems","author":"muhammad shafique","year":"2015","journal-title":"Design Automation Test in Europe Conference Exhibition (DATE)"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/SC.Companion.2012.93"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2008.2006043"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2013.6522340"},{"journal-title":"Intel Corporation","article-title":"Dual-core intel xeon processor 5100 series datasheet, revision 003","year":"2007","key":"ref9"},{"year":"2014","key":"ref1","article-title":"Eigen C++ template library (v3.2.2)"},{"key":"ref20","article-title":"AMD trinity APU","author":"nussbaum","year":"2012","journal-title":"Hot Chips"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/2656075.2656103"},{"key":"ref21","doi-asserted-by":"crossref","first-page":"1515","DOI":"10.7873\/DATE.2015.0328","article-title":"MatEx: Efficient Transient and Peak Temperature Computation for Compact Thermal Models","author":"santiago pagani","year":"2015","journal-title":"Design Automation Test in Europe Conference Exhibition (DATE)"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/2656075.2656091"},{"key":"ref23","first-page":"485","article-title":"Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects","author":"qian","year":"2013","journal-title":"ASP-DAC"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1145\/2380403.2380421"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.023"}],"event":{"name":"2015 Sixth International Green and Sustainable Computing Conference (IGSC)","start":{"date-parts":[[2015,12,14]]},"location":"Las Vegas, NV, USA","end":{"date-parts":[[2015,12,16]]}},"container-title":["2015 Sixth International Green and Sustainable Computing Conference (IGSC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7386533\/7393673\/07393727.pdf?arnumber=7393727","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,9,3]],"date-time":"2019-09-03T23:06:02Z","timestamp":1567551962000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7393727\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,12]]},"references-count":33,"URL":"https:\/\/doi.org\/10.1109\/igcc.2015.7393727","relation":{},"subject":[],"published":{"date-parts":[[2015,12]]}}}