{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,4]],"date-time":"2026-06-04T15:19:17Z","timestamp":1780586357004,"version":"3.54.1"},"reference-count":23,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,10]]},"DOI":"10.1109\/igcc.2017.8323572","type":"proceedings-article","created":{"date-parts":[[2018,3,26]],"date-time":"2018-03-26T21:04:39Z","timestamp":1522098279000},"page":"1-8","source":"Crossref","is-referenced-by-count":15,"title":["Sustainable IC design and fabrication"],"prefix":"10.1109","author":[{"given":"Donald","family":"Kline","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Nikolas","family":"Parshook","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Alex","family":"Johnson","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"James E.","family":"Stine","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"William","family":"Stanchina","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Erik","family":"Brunvand","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Alex K.","family":"Jones","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","author":"fava","year":"1991","journal-title":"A Technical Framework for LCA"},{"key":"ref11","year":"2005","journal-title":"Life Cycle Approaches The road from analysis to practice"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1021\/es034434g"},{"key":"ref13","author":"jones","year":"2009","journal-title":"Understanding the costs of MEMS products"},{"key":"ref14","author":"bahar","year":"2014","journal-title":"Workshops on ESDA Challenges and Opportunities for 2025 and Beyond"},{"key":"ref15","article-title":"Moore's Law has stopped at 28nm","author":"or-bach","year":"2014","journal-title":"Solid State Technology Insights for Electronic Manufacturing"},{"key":"ref16","article-title":"Extending the Boundaries of Life-Cycle Assessment through Environmental Economic Input-Output Models","volume":"4","author":"matthews","year":"2001","journal-title":"Jouranl of Industrial Ecology"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/MSPEC.2016.7607024"},{"key":"ref18","year":"0","journal-title":"International Technology Roadmap for Semiconductors"},{"key":"ref19","article-title":"LCA Studies of Tablets; Embodied CO2 of Tablets; Comparison with Similar Products","author":"teehan","year":"2013","journal-title":"Green Electronics Council Slates\/Tablets Workshop"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1021\/es903297k"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IGCC.2016.7892599"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-9988-7"},{"key":"ref5","year":"2015","journal-title":"Environmental Report"},{"key":"ref8","year":"2006","journal-title":"Environmental management - life cycle assessment - requirements and guidelines"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1021\/es901514n"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IGCC.2016.7892605"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691120"},{"key":"ref9","author":"vigon","year":"1993","journal-title":"LCA Inventory Guidelines and Principles"},{"key":"ref20","author":"albrecht","year":"2005","journal-title":"IWLS 2005 Benchmarks"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/MC.2007.296"},{"key":"ref21","article-title":"Using indifference points in engineering decisions","author":"scott","year":"2000","journal-title":"Proc ASME Des Eng Tech Conf"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1007\/s11367-015-0909-4"}],"event":{"name":"2017 Eighth International Green and Sustainable Computing Conference (IGSC)","location":"Orlando, FL","start":{"date-parts":[[2017,10,23]]},"end":{"date-parts":[[2017,10,25]]}},"container-title":["2017 Eighth International Green and Sustainable Computing Conference (IGSC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8318503\/8323558\/08323572.pdf?arnumber=8323572","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T04:04:21Z","timestamp":1643169861000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8323572\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,10]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/igcc.2017.8323572","relation":{},"subject":[],"published":{"date-parts":[[2017,10]]}}}