{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,16]],"date-time":"2026-05-16T09:18:15Z","timestamp":1778923095025,"version":"3.51.4"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,5,1]],"date-time":"2023-05-01T00:00:00Z","timestamp":1682899200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,5,1]],"date-time":"2023-05-01T00:00:00Z","timestamp":1682899200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,5]]},"DOI":"10.1109\/imw56887.2023.10145992","type":"proceedings-article","created":{"date-parts":[[2023,6,12]],"date-time":"2023-06-12T17:56:55Z","timestamp":1686592615000},"page":"1-4","source":"Crossref","is-referenced-by-count":7,"title":["Enabling 3D NAND Trench Cells for Scaled Flash Memories"],"prefix":"10.1109","author":[{"given":"S.","family":"Rachidi","sequence":"first","affiliation":[{"name":"Imec, Kapeldreef 75,Leuven,Belgium,B-3001"}]},{"given":"S.","family":"Ramesh","sequence":"additional","affiliation":[{"name":"Imec, Kapeldreef 75,Leuven,Belgium,B-3001"}]},{"given":"L.","family":"Breuil","sequence":"additional","affiliation":[{"name":"Imec, Kapeldreef 75,Leuven,Belgium,B-3001"}]},{"given":"Z.","family":"Tao","sequence":"additional","affiliation":[{"name":"Imec, Kapeldreef 75,Leuven,Belgium,B-3001"}]},{"given":"D.","family":"Verreck","sequence":"additional","affiliation":[{"name":"Imec, Kapeldreef 75,Leuven,Belgium,B-3001"}]},{"given":"G. L.","family":"Donadio","sequence":"additional","affiliation":[{"name":"Imec, Kapeldreef 75,Leuven,Belgium,B-3001"}]},{"given":"A.","family":"Arreghini","sequence":"additional","affiliation":[{"name":"Imec, Kapeldreef 75,Leuven,Belgium,B-3001"}]},{"given":"G. Van Den","family":"Bosch","sequence":"additional","affiliation":[{"name":"Imec, Kapeldreef 75,Leuven,Belgium,B-3001"}]},{"given":"M.","family":"Rosmeulen","sequence":"additional","affiliation":[{"name":"Imec, Kapeldreef 75,Leuven,Belgium,B-3001"}]}],"member":"263","reference":[{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2015.7409617"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IMW48823.2020.9108111"},{"key":"ref9","first-page":"4","author":"verreck","year":"0","journal-title":"Understanding the ISPP Slope in Charge Trap Flash Memory and its Impact on 3D NAND Scaling"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45625.2022.10019570"},{"key":"ref3","first-page":"2","article-title":"T8-3 Highly-Reliable Cell Characteristics with 128Layer Single-Stack 3D-NAND Flash Memory","author":"park","year":"2021","journal-title":"Symp VLSI Technol Tech Dig"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IMW52921.2022.9779303"},{"key":"ref5","first-page":"1","article-title":"A Bottom-Source Single-Gate Vertical Channel (BSSGVC) 3D NAND Flash Architecture and Studies of Bottom Source Engineering","author":"lai","year":"2016","journal-title":"2016 IEEE 8th International Memory Workshop (IMW) IMW"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IMW.2019.8739714"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IMW52921.2022.9779282"},{"key":"ref1","author":"eshghi","year":"2018","journal-title":"Inside Solid State Drives (SSDs)"}],"event":{"name":"2023 IEEE International Memory Workshop (IMW)","location":"Monterey, CA, USA","start":{"date-parts":[[2023,5,21]]},"end":{"date-parts":[[2023,5,24]]}},"container-title":["2023 IEEE International Memory Workshop (IMW)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10145914\/10145815\/10145992.pdf?arnumber=10145992","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,7,3]],"date-time":"2023-07-03T17:45:47Z","timestamp":1688406347000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10145992\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,5]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/imw56887.2023.10145992","relation":{},"subject":[],"published":{"date-parts":[[2023,5]]}}}