{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,22]],"date-time":"2026-03-22T22:42:22Z","timestamp":1774219342492,"version":"3.50.1"},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,5,12]],"date-time":"2024-05-12T00:00:00Z","timestamp":1715472000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,5,12]],"date-time":"2024-05-12T00:00:00Z","timestamp":1715472000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,5,12]]},"DOI":"10.1109\/imw59701.2024.10536967","type":"proceedings-article","created":{"date-parts":[[2024,5,24]],"date-time":"2024-05-24T17:19:11Z","timestamp":1716571151000},"page":"1-4","source":"Crossref","is-referenced-by-count":4,"title":["3D-NAND based Filtering Cube with High Resolution 2D Query and Tunable Feature Length for Computational SSD"],"prefix":"10.1109","author":[{"given":"Po-Hao","family":"Tseng","sequence":"first","affiliation":[{"name":"Macronix International Co., Ltd.,Hsinchu,Taiwan, ROC"}]},{"given":"Shao-Yu","family":"Fang","sequence":"additional","affiliation":[{"name":"Macronix International Co., Ltd.,Hsinchu,Taiwan, ROC"}]},{"given":"Yu-Hsuan","family":"Lin","sequence":"additional","affiliation":[{"name":"Macronix International Co., Ltd.,Hsinchu,Taiwan, ROC"}]},{"given":"Feng-Ming","family":"Lee","sequence":"additional","affiliation":[{"name":"Macronix International Co., Ltd.,Hsinchu,Taiwan, ROC"}]},{"given":"Jhe-Yi","family":"Liao","sequence":"additional","affiliation":[{"name":"Macronix International Co., Ltd.,Hsinchu,Taiwan, ROC"}]},{"given":"Yu-Yu","family":"Lin","sequence":"additional","affiliation":[{"name":"Macronix International Co., Ltd.,Hsinchu,Taiwan, ROC"}]},{"given":"Ming-Hsiu","family":"Lee","sequence":"additional","affiliation":[{"name":"Macronix International Co., Ltd.,Hsinchu,Taiwan, ROC"}]},{"given":"Kuang-Yeu","family":"Hsieh","sequence":"additional","affiliation":[{"name":"Macronix International Co., Ltd.,Hsinchu,Taiwan, ROC"}]},{"given":"Keh-Chung","family":"Wang","sequence":"additional","affiliation":[{"name":"Macronix International Co., Ltd.,Hsinchu,Taiwan, ROC"}]},{"given":"Chih-Yuan","family":"Lu","sequence":"additional","affiliation":[{"name":"Macronix International Co., Ltd.,Hsinchu,Taiwan, ROC"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"IEDM","author":"Ly"},{"key":"ref2","author":"Li","year":"2021","journal-title":"VLSI Tech."},{"key":"ref3","volume-title":"IEDM","author":"Tseng"},{"key":"ref4","author":"Tseng","year":"2022","journal-title":"VLSI Tech."},{"key":"ref5","volume-title":"IEDM","author":"Tseng"}],"event":{"name":"2024 IEEE International Memory Workshop (IMW)","location":"Seoul, Korea, Republic of","start":{"date-parts":[[2024,5,12]]},"end":{"date-parts":[[2024,5,15]]}},"container-title":["2024 IEEE International Memory Workshop (IMW)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10536936\/10536916\/10536967.pdf?arnumber=10536967","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,25]],"date-time":"2024-05-25T04:50:28Z","timestamp":1716612628000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10536967\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,5,12]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/imw59701.2024.10536967","relation":{},"subject":[],"published":{"date-parts":[[2024,5,12]]}}}