{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,21]],"date-time":"2025-08-21T17:29:41Z","timestamp":1755797381252,"version":"3.44.0"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,5,18]],"date-time":"2025-05-18T00:00:00Z","timestamp":1747526400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,5,18]],"date-time":"2025-05-18T00:00:00Z","timestamp":1747526400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,5,18]]},"DOI":"10.1109\/imw61990.2025.11026948","type":"proceedings-article","created":{"date-parts":[[2025,6,12]],"date-time":"2025-06-12T13:40:04Z","timestamp":1749735604000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Monolithic 3D Macro Integrating CMOS with Ambipolar SONOS Tunnel FET for High Performance Edge-AI Computing Applications"],"prefix":"10.1109","author":[{"given":"P. H.","family":"Tseng","sequence":"first","affiliation":[{"name":"Macronix International Co. Ltd,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"F. M.","family":"Lee","sequence":"additional","affiliation":[{"name":"Macronix International Co. Ltd,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C. C.","family":"Yang","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Research Institute,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H. W.","family":"Chiang","sequence":"additional","affiliation":[{"name":"National Taiwan University,Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C. T.","family":"Huang","sequence":"additional","affiliation":[{"name":"National Taiwan University,Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Y. H.","family":"Lin","sequence":"additional","affiliation":[{"name":"Macronix International Co. Ltd,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu-Yu","family":"Lin","sequence":"additional","affiliation":[{"name":"Macronix International Co. Ltd,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"N. C.","family":"Lin","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Research Institute,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"P. J.","family":"Sung","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Research Institute,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C. T.","family":"Wu","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Research Institute,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"W. F.","family":"Wu","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Research Institute,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C. H.","family":"Shen","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Research Institute,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"T. H.","family":"Hou","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Research Institute,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A. Y.","family":"Wu","sequence":"additional","affiliation":[{"name":"National Taiwan University,Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H. Y.","family":"Cheng","sequence":"additional","affiliation":[{"name":"Academia Sinica,Research Center for Information Technology Innovation,Taipei,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"T. H.","family":"Yeh","sequence":"additional","affiliation":[{"name":"Macronix International Co. Ltd,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M. H.","family":"Lee","sequence":"additional","affiliation":[{"name":"Macronix International Co. Ltd,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K. Y.","family":"Hsieh","sequence":"additional","affiliation":[{"name":"Macronix International Co. Ltd,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"IEEE VLSI Tech.","year":"2023","author":"Okamoto","key":"ref1"},{"journal-title":"IEEE VLSI Tech.","year":"2023","author":"Lu","key":"ref2"},{"volume-title":"IEDM","author":"Lee","key":"ref3"},{"key":"ref4","doi-asserted-by":"crossref","first-page":"521","DOI":"10.1038\/s41928-019-0321-3","volume":"2","author":"Ni","year":"2019","journal-title":"Nat. Electronics"},{"journal-title":"IEEE VLSI Tech.","year":"2022","author":"Zhang","key":"ref5"},{"volume-title":"IEEE JSSC","author":"Pagiamtzis","key":"ref6"},{"journal-title":"IEEE VLSI Tech.","year":"2013","author":"Li","key":"ref7"},{"volume-title":"IEEE TED","author":"Yin","key":"ref8"},{"journal-title":"IEEE VLSI Tech.","year":"2022","author":"Luo","key":"ref9"},{"volume-title":"NIPS","author":"Vinyals","key":"ref10"}],"event":{"name":"2025 IEEE International Memory Workshop (IMW)","start":{"date-parts":[[2025,5,18]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2025,5,21]]}},"container-title":["2025 IEEE International Memory Workshop (IMW)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11026918\/11026883\/11026948.pdf?arnumber=11026948","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,18]],"date-time":"2025-08-18T19:37:55Z","timestamp":1755545875000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11026948\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,5,18]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/imw61990.2025.11026948","relation":{},"subject":[],"published":{"date-parts":[[2025,5,18]]}}}