{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,11]],"date-time":"2025-09-11T18:44:30Z","timestamp":1757616270599,"version":"3.44.0"},"reference-count":29,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,7]]},"DOI":"10.1109\/indin41052.2019.8972096","type":"proceedings-article","created":{"date-parts":[[2020,1,31]],"date-time":"2020-01-31T00:16:43Z","timestamp":1580429803000},"page":"1435-1442","source":"Crossref","is-referenced-by-count":0,"title":["Flow Disruptions and Mitigation in Virtualized Water-Cooled Data Centers"],"prefix":"10.1109","author":[{"given":"Udaya","family":"Puvvadi","sequence":"first","affiliation":[{"name":"State University of New York,Binghamton,NY,13902"}]},{"given":"Anuroop","family":"Desu","sequence":"additional","affiliation":[{"name":"State University of New York,Binghamton,NY,13902"}]},{"given":"Tyler","family":"Stachecki","sequence":"additional","affiliation":[{"name":"State University of New York,Binghamton,NY,13902"}]},{"given":"Sami","family":"Alkharabsheh","sequence":"additional","affiliation":[{"name":"State University of New York,Binghamton,NY,13902"}]},{"given":"Kanad","family":"Ghose","sequence":"additional","affiliation":[{"name":"State University of New York,Binghamton,NY,13902"}]},{"given":"Bahgat","family":"Sammakia","sequence":"additional","affiliation":[{"name":"State University of New York,Binghamton,NY,13902"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1147\/rd.466.0753"},{"key":"ref11","first-page":"14","article-title":"High powered chip cooling-air and beyond","volume":"11","author":"ellsworth","year":"2005","journal-title":"Electronics Cooling"},{"journal-title":"Green Revolution Cooling Submersion Cooling product web","year":"0","key":"ref12"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2012.6188851"},{"journal-title":"Java SciMark 2 0","year":"0","key":"ref14"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1115\/IPACK2018-8422"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/MCSA.2002.1017484"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/CICT.2013.6558130"},{"journal-title":"Libvirt web","year":"0","key":"ref18"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2011.2155610"},{"journal-title":"SPECjvm2008","year":"0","key":"ref28"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2004.840855"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1145\/1060289.1060324"},{"journal-title":"Data Center Cooling Solutions Product Pages for Rack DCU and Internal Loop","year":"0","key":"ref3"},{"journal-title":"CoolIT Systems Rack DCLC Product Guide Product Document No 761-00012","year":"0","key":"ref6"},{"key":"ref29","first-page":"380","article-title":"Cooling fan reliability: failure criteria, accelerated life testing, modeling and qualification","author":"tian","year":"2006","journal-title":"Proc Annual Reliability and Maintainability Symp"},{"journal-title":"RDHx Rear-door Heat Exchanger Product web","year":"0","key":"ref5"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1115\/IPACK2013-73183"},{"journal-title":"Publication number CEC-(report number pending)","article-title":"Demonstration of Direct Liquid Cooling for Electronic Equipment.* California Energy Commission","year":"2004","key":"ref7"},{"journal-title":"Allied Control Immersion Cooling System Product Pages","year":"0","key":"ref2"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/1996130.1996151"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1115\/1.4031326"},{"key":"ref20","article-title":"Rise of Direct Liquid Cooling in Data Centers Likely Inevitable","author":"miller","year":"2014","journal-title":"Data Center Knowledge"},{"journal-title":"Electronics Cooling","article-title":"New Liquid Cooled HPC Cluster Launched","year":"2016","key":"ref22"},{"journal-title":"MP3 Library for the Java Platform","year":"0","key":"ref21"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/CLOUD.2019.00057"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/1060289.1060323"},{"key":"ref26","first-page":"135","author":"sharma","year":"0","journal-title":"Thermofluidics and energetics of a manifold microchannel heat sink for electronics with recovered hot computing (HPDC '11)"},{"journal-title":"Rittal In-line cooler product overview","year":"0","key":"ref25"}],"event":{"name":"2019 IEEE 17th International Conference on Industrial Informatics (INDIN)","start":{"date-parts":[[2019,7,22]]},"location":"Helsinki, Finland","end":{"date-parts":[[2019,7,25]]}},"container-title":["2019 IEEE 17th International Conference on Industrial Informatics (INDIN)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8961950\/8972012\/08972096.pdf?arnumber=8972096","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,5]],"date-time":"2025-09-05T18:09:29Z","timestamp":1757095769000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8972096\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,7]]},"references-count":29,"URL":"https:\/\/doi.org\/10.1109\/indin41052.2019.8972096","relation":{},"subject":[],"published":{"date-parts":[[2019,7]]}}}