{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,26]],"date-time":"2025-10-26T15:11:43Z","timestamp":1761491503292,"version":"3.28.0"},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,7,25]],"date-time":"2022-07-25T00:00:00Z","timestamp":1658707200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,7,25]],"date-time":"2022-07-25T00:00:00Z","timestamp":1658707200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,7,25]]},"DOI":"10.1109\/indin51773.2022.9976162","type":"proceedings-article","created":{"date-parts":[[2022,12,15]],"date-time":"2022-12-15T20:05:02Z","timestamp":1671134702000},"page":"572-577","source":"Crossref","is-referenced-by-count":2,"title":["Deep Learning for Semiconductor Defect Classification"],"prefix":"10.1109","author":[{"given":"Terence","family":"Sweeney","sequence":"first","affiliation":[{"name":"Ulster University,School of Computing, Engineering and Intelligent Systems,Londonderry,Northern Ireland"}]},{"given":"Sonya","family":"Coleman","sequence":"additional","affiliation":[{"name":"Ulster University,School of Computing, Engineering and Intelligent Systems,Londonderry,Northern Ireland"}]},{"given":"Dermot","family":"Kerr","sequence":"additional","affiliation":[{"name":"Ulster University,School of Computing, Engineering and Intelligent Systems,Londonderry,Northern Ireland"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1023\/B:VISI.0000029664.99615.94"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV.2011.6126544"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1007\/11744023_32"},{"key":"ref13","article-title":"A Machine Learning Approach to Wafer Defect Classification using Bag of Visual Words","volume":"2019","author":"sweeney","year":"2019","journal-title":"Irish Machine Vision and Image Processing Conference"},{"key":"ref14","first-page":"1307","article-title":"Automated inspection of IC wafer contamination","author":"reza","year":"2001","journal-title":"Pattern Recognition"},{"key":"ref15","doi-asserted-by":"crossref","first-page":"309","DOI":"10.1109\/TSM.2018.2795466","article-title":"Wafer Map Defect Pattern Classification and Image Retrieval Using Convolutional Neural Network","volume":"31","author":"takeshi","year":"2018","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"key":"ref16","first-page":"641","article-title":"Reclaim wafer defect classification using large scale BPNS with Tensorflow","author":"tien","year":"2018","journal-title":"National academy of managerial staff of culture and arts herald"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/34.3863"},{"key":"ref18","article-title":"Wafer Defects Detecting and Classifying System Based on Machine Vision","author":"zeng","year":"2007","journal-title":"8th International Conference on Electronic Measurement and Instruments"},{"key":"ref19","article-title":"Recognition and classification of coating film defects on automobile body based on image processing","author":"pu","year":"2017","journal-title":"2017 10th International Congress on Image and Signal Processing BioMedical Engineering and Informatics"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.engappai.2012.03.016"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.1991.238937"},{"year":"2019","key":"ref6","article-title":"Rudolph August NSX 105 Automated Defect Inspection"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1117\/12.429361"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/s001380050041"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/54.990441"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/34.3863"},{"key":"ref9","article-title":"A 3x3 Isotropic Gradient Operator for Image Processing","author":"sobel","year":"1968","journal-title":"Stanford Artificial Intelligence Project"},{"key":"ref1","doi-asserted-by":"crossref","first-page":"337","DOI":"10.1016\/j.mee.2004.12.003","article-title":"Defect detection on semiconductor wafer surfaces","volume":"77","author":"g","year":"2005","journal-title":"Microelectronic Engineering"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1007\/s40684-016-0039-x"},{"journal-title":"Deep Learning with Keras","year":"2017","author":"gulli","key":"ref21"}],"event":{"name":"2022 IEEE 20th International Conference on Industrial Informatics (INDIN)","start":{"date-parts":[[2022,7,25]]},"location":"Perth, Australia","end":{"date-parts":[[2022,7,28]]}},"container-title":["2022 IEEE 20th International Conference on Industrial Informatics (INDIN)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9975846\/9976066\/09976162.pdf?arnumber=9976162","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,1,16]],"date-time":"2023-01-16T19:31:26Z","timestamp":1673897486000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9976162\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,7,25]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/indin51773.2022.9976162","relation":{},"subject":[],"published":{"date-parts":[[2022,7,25]]}}}